by Jeff Zopff | Oct 6, 2014 | Blog
October 6, 2014 – Lead-to-hole ratio is the amount of variance between the largest diameter/diagonal of the lead to the smallest diameter of the hole. This factor has to be considered in the determination of viability for automation. There are so many factors...
by Jeff Zopff | Sep 30, 2014 | Blog
September 30, 2014 – Component packaging is the single most important issue to take into account when considering automation for odd-form factor components. The electronics industry is pretty unique in that the majority of components are regulated by a...
by Jeff Zopff | Jul 24, 2014 | Blog
July 24, 2014 – It is not just another robotic platform that can handle the rigors of inserting small to large, light to heavy odd-form components. The platform must have the flexibility to use gripper tooling or vacuum nozzles and sometimes both. And the...
