Since 1919
About Us
Innovation in Electronics Assembly
Build better. Build more. Spend less.
THIS IS US
At Universal, we strive to build upon our proud heritage of engineering and disruptive innovation to drive the future of the electronics industry, and to deliver products that inspire our customers to build better!
We are a technology leader in the design and manufacture of precision automation solutions for the semiconductor and electronics manufacturing industry. With a lineage of more than 100 years, we are the longest-standing electronics assembly company. Our technology solutions are truly universal and span the range of assembly applications- from lighting to automotive, medical, computing, entertainment, mobility, industrial and more.
We employ a highly technical workforce of ~ 500 employees. This expertise and passion to develop innovative solutions to solve our customer’s problems drive our 500+ strong patent portfolio. With 27,000+ systems delivered to date, we offer the broadest range of world-class equipment and services. We also enjoy strategic partnerships with today’s industry leaders, which enables us to stay on the leading edge of technology trends and to deliver the best solutions for the production of a wide variety of the most complex electronic circuits in the World.
We offer solutions for a wide range of high-precision assembly needs, including Precision Automation for applications requiring versatile, high-accuracy, high-speed handling, inspection, and assembly. Advanced Packaging for applications requiring efficient and versatile multi-die high-accuracy assembly. Traditional to Complex Printed Circuit Board Assembly for applications requiring high-speed, high-accuracy surface mount placement and through-hole component insertion. Our cutting-edge smart manufacturing software provides real-time data to help manufacturers improve their overall operations. And, our world-renowned Advanced Process Lab (APL) offers solutions for all aspects of a product lifecycle- from prototyping, process development, and analytical services to advanced technology assembly.
We are committed to creating the most innovative solutions for all aspects of electronics assembly; enabling our customers to maximize their return on investment across their entire product lifecycle.
INNOVATING FOR OVER A CENTURY
OUR HISTORY
Universal Instruments traces its roots to the Universal Instruments and Metal Company, a safety pin manufacturer founded in 1919. Through time, the company discontinued safety pin production and made a transition to a machining and tool and die business. By controlling costs during the Great Depression, Universal Instruments continued to grow through World War II, when the company’s tool and die talents were pressed to meet the needs of the state’s small arms manufacturers. This work continued until the 1950s, when Universal Instruments entered the electronics assembly equipment manufacturing industry.
Universal Instruments first built electronic circuit assembly equipment for through-hole components in the 1960s. For nearly three decades Universal Instruments flourishes by the production of axial, radial, and DIP insertion equipment. In 1993 Universal Instruments acquired Dynapert through-hole assembly machine business that opened the Southeast Asian markets. Enhancements in the through-hole world continue to this day, and Universal Instruments holds nearly half of the global through-hole market.
The global electronics industry burgeoned with the transition from through-hole to surface mount components. In the early 1990′s Universal Instruments developed a modular platform-based surface mount technology machine – the GSM Platform. With an installed base of over five thousand machines, Universal’s GSM quickly became the industry standard in the flexible fine pitch arena.
Today, Universal’s core products include a comprehensive surface mount platform portfolio delivering best-in-class performance and value for any budget or production environment; leading-edge advanced semiconductor packaging solutions for a fast-evolving technology landscape; a through-hole lineup that is the industry standard for productivity and reliability; flexible automation cells for odd-form or light mechanical and back-end assembly; line software to manage manufacturing activities and deliver true control over manufacturing profitability; and industry-leading support and services worldwide to help our customers build better, build more, and spend less.
MANAGEMENT TEAM
driven to achieve
Universal’s senior management team possesses rich and diverse industry knowledge and experience coming from leading positions at some of the World’s leading companies. Its mission is to deliver an unprecedented level of commitment and value to our customers. Read more about our impressive team below.
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Bennett has held various management roles at Universal, most recently as Business Unit General Manager and VP, and 15 years prior as Vice President of Global Field Operations. In that role, he was responsible for the profitable growth of six regions with diverse product line objectives.
Bennett has more than 25 years of driving revenue growth and securing new customer penetrations in highly competitive capital goods markets. He holds a Bachelor of Science in Industrial Engineering from Purdue University.
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Kevin Wu, Vice President of Global Supply Chain, has spent 25 years in the supply chain field and has extensive experience in process, system, and organization development. Kevin has held executive-level roles at several companies, including those in the semiconductor equipment assembly industry, where he spearheaded supply chain transformations.
Prior to joining Universal, Kevin was a Senior Director of Supply Chain at Brother International in NJ, where he led Procurement, Planning, Customer Order Management, and Continuous Improvement organizations. Kevin also held director-level roles at Columbia Tech and Lanxess, and management roles at First Solar and IBM. He was born and raised in mainland China and came to the US to advance his education in engineering and business administration.
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Joe Mott directs all functions of our global human resources department. He supervises and provides consultation to our management team on strategic staffing plans, such as: compensation, benefits, training and personnel development, etc. Throughout his career, Joe has demonstrated exceptional ability as an agent of change and a strategic business partner, helping companies to scale, grow and globalize.
His background includes many years of providing human resources solutions for L-3 Vertex Logistics Solutions and SOS International Ltd. both companies specializing in aerospace, aviation and defense industries for the US Government and which brought him to countries including Iraq, Afghanistan, Kuwait, Dubai, and Columbia.
Joe is an innovative and resourceful professional with extensive HR management experience and expertise in labor relations, policy, procedure, and best practice implementation. Joe holds a Bachelor’s of Applied Science (B.A.Sc) in Human Resources Management and Services from SUNY, Oswego, as well as the following certifications: DDI Certified Trainer, OZ Principle of Accountability Certified Trainer.
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As Vice President of Engineering, Phil is responsible for leading our global engineering organization which brings life to our new product and technology offerings across all of Universal’s products lines.
Phil joined us in 2000 and has held several leadership positions of increasing responsibility while remaining closely tied to technology.
He started his career at Universal as an entry level engineer and quickly advanced into a lead engineer role. In 2005 he moved to Shekou China to manage a cross functional team of engineers all while continuing to pursue his graduate degree. Upon his return he became a Technical Manager and Project Manager where he guided the development programs for many of the products in Universal’s product portfolio. In 2017, Phil was promoted to Engineering Product Manager for Uflex and Automation solutions delivering custom solutions across to our global customer base. In 2020, he was named Director of Platform Engineering responsible for all hardware development, and then in 2021, he has taken the reigns to lead the entire engineering organization.
Phil holds a BSME from Clarkson University and a MSME from Binghamton University.
Phil has a proven track record of delivering market dominating products and solutions to our customers through the application of strong leadership skills rooted in technology and program management.
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Shane Nunes, Vice President of the Products Group, is a seasoned leader dedicated to shaping our portfolio strategy and solutions to align seamlessly with our customers’ evolving needs in both current and future technologies. In his role, Shane oversees Product Management, Product Marketing, and Sales Support ensuring a holistic approach to delivering value.
Shane brings over a decade of invaluable experience within the semiconductor industry, covering the full spectrum from the Front End of the Line to the Back End of the Line, including expertise in semiconductor manufacturing, assembly processes and capital equipment. Throughout his career, Shane has consistently earned recognition for his visionary strategies, impeccable execution, remarkable product management skills, and astute leadership. His relentless commitment to achieving exceptional results and driving growth in the global semiconductor B2B market underscores his unwavering dedication to excellence.
Shane’s academic background includes a Bachelor of Science in Chemistry from the esteemed Virginia Military Institute, complemented by ongoing studies toward a Master’s in Management from Harvard University. His blend of practical experience and educational pursuit positions him as a forward-thinking executive, poised to navigate the dynamic landscape of the semiconductor industry with precision and innovation for Universal Instruments.
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Dave Hare, Director of Production Operations, providing manufacturing leadership at Universal’s Conklin, NY and Rochester, NY facilities. Hare joined Universal in 2021 after 30-plus years of service in IBM’s Systems and Technology Group organization. Hare has 25 years of people management experience and led IBM’s global “Path Forward to Advanced Manufacturing” initiative for 15 years. Hare is a subject matter expert in the Science of Manufacturing and Organizational Culture Change, leading organizational transformation efforts at IBM. Dave’s educational background is in Industrial Science, with accreditation in Project/Program Management, Social and Behavioral Science, Manufacturing Science and Executive Leadership Coaching. Hare has received 11 USA Patents.
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Michael Kane, Director, Applications Engineering is responsible for leading the global development of Precision Automation Solutions serving the Electronics Assembly market. Solutions include Universal’s product lines, Integration of Delta Electronics automation solutions, Advanced packaging (semiconductor) customizations, hand assembly solution equipment and application specific feeders.
Mike Joined Universal Instruments in June of 1983 shortly after graduating from SUNY with a Bachelors in Electrical Engineering. He has held multiple positions including Field Engineer, Electrical Engineer, Engineering Management, Program Management, Product Management (SM, IM, APAS) and Solutions Development.