Join us on December 16 for a FREE webinar:
**Place your DIE and Win with Heterogeneous Integration**
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Multiple global time-zone friendly sessions available (@ 9 am, 2 pm & 8 pm EDT), click HERE to sign up!
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Chance to WIN an Amazon or VISA Gift Card; test your trivia knowledge and more. . .
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Take a spin on the APAS Acronym Slots to learn the meaning behind a few common APAS terms
Learn more about the exciting Advanced Packaging technology
—Heterogeneous Integration (HI)
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HI refers to the integration of multiple component types (die, MEMS, passive, etc.) into a higher-level assembly (or system-in-package), which delivers increased functionality at a lower cost.
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HI presents a distinctive set of challenges which require unique assembly solutions. What are those challenges and what are the potential solutions for cost-effective multi-die assembly?
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What markets will benefit from HI and how will it enable the world’s most innovative products for 5G, AI, Edge Computing and more. . .
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Click HERE to sign up!
Hosted by Glenn Farris, VP Strategic Marketing – a industry expert with 30+ years of broad-based experience implementing solutions to address the challenges faced by the Advanced Packaging industry.
At this webinar, you’ll learn about:
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What’s the big deal with Heterogeneous Integration (HI) and what benefits does it provide?
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What are the markets and outlook for HI?
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Why is HI essential for today’s leading-edge technologies?
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What are the challenges and assembly solutions for HI?
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Click HERE to sign up!
We look forward to seeing you on December 16!