Industry expert David McCann, vice president, Packaging and R&D, GLOBALFOUNDRIES, will present keynote address at technology-sharing event.
August 28, 2013 – On September 24–26, Universal Instruments’ Advanced Process Lab (APL) will hold a reunion of former Advanced Research in Electronics Assembly (AREA) Consortium students in conjunction with the final group meeting of the year. Keynote speaker David McCann, who will present Trends in the Development and Implementation of Interconnect and Packaging Technologies, will highlight the event. Specifically, McCann will speak to the challenges and solutions associated with applying 2.5D and 3D interconnect and assembly technologies.
“We’re ecstatic to have a speaker of David’s reputation join us and share his perspective with the group,” said Martin Anselm, PhD, manager of the AREA Consortium. “3D packaging is an emerging technology that demands unique economic, design and process considerations. David’s presentation will provide valuable insight for both our current consortium members and former students,” he added.
The first day of the event will feature a reunion for students returning to celebrate the history of the AREA Consortium. Since 1992, the AREA Consortium Student Development Program has contributed to student funding in a cooperative effort with leading universities including Binghamton University, Cornell University, Columbia University, Clarkson University, and Virginia Tech. To date, the program has helped educate and train more than 200 students, many of who have gone on to high-level positions in companies across a variety of technology-driven fields.
McCann’s presentation will open the second day of activity, followed by formal consortium technical sessions focused on leading-edge topics related to materials, advanced process development, and reliability. Day two will close with a series of research-planning sessions designed to identify relevant research for next year, as well as an awards ceremony to honor long-standing consortium members who have made significant contributions. A continuation of the technical sessions will be presented on the closing day of the meeting.
To learn more about the APL’s AREA Consortium, including how to become a member, please contact AREA Consortium Manager Martin Anselm at 607-779-5077 or anselm@uic.com, or AREA Consortium Associate Director Denis Barbini at 603-828-2289 or barbini@uic.com. To find out how Universal’s Advanced Process Laboratory can help your organization, contact APL Director David Vicari at 607-779-5151 or vicari@uic.com.