Upcoming SMTA Webtorial on July 15^th, 1:00pm to 2:30pm Eastern time: Failure Analysis – Lessons Learned in Manufacturing. Presented by Dr. Martin Anselm from Universal Instruments Corp. Click the link to register: http://smta.org/education/registration/event_registration.cfm?EVENT_ID=1048

July 7, 2014 – Universal Instruments Corporation’s Advanced Process Laboratory has observed countless failures in electronics manufacturing. From fine pitch printing, to PoP and high Tg laminate failures. These failures combined with internal research have provided a unique perspective for design for manufacturability and reliability. These lessons will be presented to the class when we discuss material selection, current electronics research, and failure analysis case studies. We will touch on design considerations for many advanced assembly processes as well as discussing types of analytical techniques that can be used for materials characterization.

Topics that will be covered in the SMTA Webtorial on July 15^th:

• What the major difficulties in lead-free reliability testing are
• Mixed alloy assembly best practices
• PCB plating considerations
• Analytical testing techniques and what they can identify root causes for production failures
• Lead-free laminate selection and testing procedures: Can your board withstand 9x reflow?
• Learned lessons from actual failure analysis case studies
• FA Tools and Techniques to be discussed include the following:
  • Thermogravimetric Analysis & IR Ion Chromatography
  • Ion Contamination
  • Shadow Moire
  • SEM/EDS Wetting Balance/Solderability
  • Acoustic Microscopy
  • White Light Interferometry
  • Mechanical Testing
  • Optical Microscopy
  • Mechanical Strain Gauge Analysis & Strain limits
  • X-Ray Inspection
  • Environmental Testing
  • Solder Paste Print Transfer Efficiency
  • Micro Hardness Testing
  • Dye Penetration Testing
  • Micro Sectioning
  • Cross-section Etching

For more information about the Advanced Process Lab, go to http://www.uic-apl.com/home or contact David Vicari via vicari@uic.com/+1 607-779-5151.