UPCOMING
EVENTS
Keep track of Universal’s technology tour as we navigate a challenging environment for sharing knowledge with our colleagues and customers. We’ll be using every available platform to let you know what’s new and exciting at Universal. Watch out for our virtual and live trade show schedule.
SMT Hybrid Packaging 2017
Visit Universal on Hall 4-101 on May 16–18 and let our solutions experts help you optimize productivity for your greatest packaging and production challenges.
IPC APEX EXPO 2017
Visit Universal on Booth #827 on February 14–16 to see our latest technology innovations and discuss your specific production challenges with our solutions experts.
SMTA International 2016
Visit Universal on Booth #807 on September 27–28 and see how our solutions experts can help with your specific production challenges.
SMT Hybrid Packaging 2016
Visit Universal on Channel Partner smartTec’s Hall 7-109 at SMT Hybrid Packaging 2016 on April 26–28 to see demonstrations on our Fuzion1-30 Platform and Polaris Multi-Process Assembly Cell, or discover how our solutions experts can help with your specific production challenges.
NEPCON China 2016
Visit Universal on Channel Partner Gentron’s Booth# B-1J35 at NEPCON China 2016 on April 26–28 and see two new innovative high-volume production solutions: the Flexbond™ automated high-volume hot bar bonding platform and the high-speed DIMM Socket Feeder.
APEX 2016
Visit Universal on Booth 2441 at the 2016 IPC APEX EXPO 2016 on March 15–17 and see two pioneering additions to the industry’s most comprehensive solutions portfolio: the Uflex™ modular automation platform and the Flexbond™ hot bar bonding platform.
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