EVENTS

Visit Universal at SEMICON West on December 7-9, 2021 in San Francisco, CA to learn about the leading-edge solutions we offer for current and future Advanced Packaging challenges. Some of our core competencies include solutions for 2D, 2.5D, and 3D semiconductor applications requiring high accuracy and efficient die handling. Everything from direct die and flip chip to multi-die heterogeneous integration. Join us at the event for a demo of our High-Speed Wafer Feeder and FuzionSC™ system – the ultimate tool for heterogeneous integration.

Visit Universal on Booth 3007 on November 1-4 in Minneapolis, MN to discuss your Traditional to Complex SMT assembly, Odd-Form or Precision Automation or Advanced Packaging requirements. Facing current or next-generation technology challenges, speak with the experts from our Advanced Process Lab (APL). The APL will also present at multiple technical sessions during the four-day Conference.

Visit Universal on Booth 1837 on February 4-6 to see demonstrations on our IQ360™ Factory Software Suite machine-to-machine process controls and learn how our flexible assembly platforms combined with our integrated end-to-end smart factory solutions can streamline your production flow and drive operational excellence into your factory.

Visit Universal on Booth 1215 on September 24–25 to discuss your current and next-generation technology challenges with Universal’s Advanced Process Lab (APL) experts. The APL will also present at multiple technical sessions during the four-day Conference taking place on September 22–26.

Visit Universal on Booth 1E27 on April 24–26 to discuss your specific manufacturing challenges with our experts and discover how Universal can provide the perfect solution you’ve been waiting for.

Visit Universal on Booth 2308 on January 29–31 as we celebrate our 100th Anniversary! See demonstrations on some solutions from our comprehensive product portfolio talk with our experts to find out how you can streamline your production flow and maximize productivity.