UPCOMING
EVENTS
Keep track of Universal’s technology tour as we navigate a challenging environment for sharing knowledge with our colleagues and customers. We’ll be using every available platform to let you know what’s new and exciting at Universal. Watch out for our virtual and live trade show schedule.
IPC APEX EXPO 2024
Visit Universal on Booth 2405 on April 9-11 to learn how to simplify your down-line processes with intelligent solutions that align with your level of automation experience. From the basic user to the power user, Universal offers plug-and-play through highly configurable solutions for complex automation tasks.
IPC APEX AXPO 2023
Visit Universal on Booth 1749 on January 24-26 to learn how to drive operational excellence into your factory. From complex odd-form to mission-critical micro, Universal has the precision automation solution for your unique challenges.
SMTA International 2022
Visit us on Booth 707 on November 2–3 in Minneapolis, MN to discover how Universal is uniquely positioned to deliver solutions for your Precision Automation, Advanced Packaging or PCB Assembly requirements. Experts from our Advanced Process Lab will also be on-hand to discuss your advanced process and materials challenges, while also copresenting a Technical Session on Conformal Coating on November 1.
PSECE 2022
Visit Universal Instruments and Channel Partner, Elitech Trading Corporation on Booths 49 & 50 at PSECE 2022 (17th Philippine Semiconductor & Electronics Exhibition & Convention) on November 16–18, 2022. Universal offers solutions for a complete range of advanced semiconductor packaging applications leveraging the High-Speed Wafer Feeder (HSWF) combined with the FuzionSC™ Platform – the ultimate multi-die solution for heterogeneous integration.
SEMI Vietnam Business Summit 2022
Universal Instruments is proud to be a Silver Sponsor of 2022 SEMI Vietnam Business Summit, a semiconductor technology exhibition taking place on November 10–11, 2022. Universal Instruments offers comprehensive solutions for 2D, 2.5D and 3D semiconductor applications requiring high accuracy and efficient die handling, from direct die and flip chip to multi-die heterogeneous integration.
SMT Connect 2022
Visit Universal at SMT Connect on May 10-12 in Nuremberg, Germany in Hall 4A, Stand 210 to discuss Traditional to Complex SMT assembly, Odd-Form or Precision Automation, or Advanced Packaging requirements. Come see a DEMO of our flexible and reconfigurable Uflex™ platform – the ultimate solution for all of your odd-form automation needs!
Connect
Stay up to date with all the latest UIC news on our Social Medial channels!