by Jeff Zopff | Jul 5, 2017 | Press Release
Experienced team leverages local knowledge to ensure superior customer experience. July 5, 2017 – Universal Instruments has enriched its customer coverage in Mexico with the addition of a new Channel Partner, SMTo Engineering S.A. de C.V. SMTo Engineering...
by Jeff Zopff | May 8, 2017 | Press Release
Versatile portfolio performs full range of automation tasks to meet today’s market challenges. May 8, 2017 – Universal Instruments will exhibit on Channel Partner SmartTec’s Hall 4, Booth 101 at the SMT Hybrid Packaging trade show in Nuremberg, Germany on May...
by Jeff Zopff | Mar 20, 2017 | Press Release
New leadership to leverage wide-ranging experience to drive global growth initiatives. March 20, 2017 – Universal Instruments announces the appointment of three new regional managers to its global sales team. David Cooke has joined Universal Instruments as...
by Jeff Zopff | Mar 8, 2017 | Press Release
World-class Taiwanese EMS finds formula to meet aggressive market demands with flexible Fuzion® Platform. March 8, 2017 – Taiwan-based EMS, Wistron Corporation continues to successfully adapt to its evolving customer product portfolio with a manufacturing model...
by Jeff Zopff | Feb 2, 2017 | Press Release
AdvantisV™ combines the best in technology and performance with a low entry price and unmatched scalability. February 2, 2017 – Universal Instruments will unveil a new midrange addition to its industry-leading platform portfolio on booth 827 at the 2017 IPC APEX...
by Jeff Zopff | Oct 11, 2016 | Press Release
Unique architecture enables the first true volume solution for today’s consumer demands. October 11, 2016 – Universal Instruments’ Flexbond™ hot bar bonding platform was presented the Global SMT & Packaging Global Technology Award at the 2016 SMTA...
