by Jeff Zopff | Nov 3, 2014 | Blog
November 3, 2014 – Universal Instruments’ AREA Consortium has linked meetings with the IPC PERM Council this time around to encourage synergistic research opportunities between the two organizations. PERM members that will participate in this joint meeting...
by Jeff Zopff | Oct 30, 2014 | Blog
October 30, 2014 – October 22nd 2014, Universal Instruments participated in the Intelligent Manufacturing Industry Development Forum at the China Circum-Bohai Electronics Manufacturing and Intelligent Automation Exhibition (CEIA) in Tianjin, China. Glenn Farris,...
by Jeff Zopff | Oct 25, 2014 | Blog
October 25, 2014 – “There is no such thing as an ESD-safe machine without an ESD-safe nozzle.” Universal Instruments was a pioneer in ESD-safe (Electrostatic Discharge) machinery and tooling, so when an opportunity to validate this investment presented itself…...
by Jeff Zopff | Oct 16, 2014 | Blog
October 16, 2014 – When I meet people in the electronics industry and tell them I am the Marketing Manager for through-hole products at Universal Instruments, they almost always say “You still sell those machines? I thought through-hole technology is DEAD”. I...
by Jeff Zopff | Oct 14, 2014 | Blog
October 14, 2014 – Pad cratering occurs when there is a break within the resin between the copper foil and outermost layer of fiberglass of a PCB (cohesive), or at the resin-to-glass interface (adhesive). The pad is separated from the PCB, leaving a crater on...
by Jeff Zopff | Oct 10, 2014 | Blog
October 10, 2014 – While it may seem unusual to discuss mechanics in an electronics-oriented document, the success of automating odd-form components hinges on the stability of the mechanics of the component. Of course it is the geometry of the component related...
