by Jeff Zopff | Oct 16, 2014 | Blog
October 16, 2014 – When I meet people in the electronics industry and tell them I am the Marketing Manager for through-hole products at Universal Instruments, they almost always say “You still sell those machines? I thought through-hole technology is DEAD”. I...
by Jeff Zopff | Oct 14, 2014 | Blog
October 14, 2014 – Pad cratering occurs when there is a break within the resin between the copper foil and outermost layer of fiberglass of a PCB (cohesive), or at the resin-to-glass interface (adhesive). The pad is separated from the PCB, leaving a crater on...
by Jeff Zopff | Oct 10, 2014 | Blog
October 10, 2014 – While it may seem unusual to discuss mechanics in an electronics-oriented document, the success of automating odd-form components hinges on the stability of the mechanics of the component. Of course it is the geometry of the component related...
by Jeff Zopff | Oct 6, 2014 | Blog
October 6, 2014 – Lead-to-hole ratio is the amount of variance between the largest diameter/diagonal of the lead to the smallest diameter of the hole. This factor has to be considered in the determination of viability for automation. There are so many factors...
by Jeff Zopff | Sep 30, 2014 | Blog
September 30, 2014 – Component packaging is the single most important issue to take into account when considering automation for odd-form factor components. The electronics industry is pretty unique in that the majority of components are regulated by a...
by Jeff Zopff | Sep 25, 2014 | Blog
September 25, 2014 – The APL’s AREA Consortium will present four papers at the SMTAi technical conference. In session on Oct 1, Dr. Martin Anselm is going to talk about Component Warpage: Issues with Measurement and Standardization. In the Lead-Free Symposium on...
