by Jeff Zopff | Jan 7, 2015 | Blog
[section background_repeat=”repeat” background_position=”center top” background_attachment=”static” background_scroll=”none”] January 6, 2015 – Imagine for example, combining active die components, WLCSPs, uBGAs...
by Jeff Zopff | Dec 11, 2014 | Blog
December 11, 2014 – You might ask, “What’s the difference between this nozzle and the older conical 0402 ceramic nozzle?” Simply put, we think this latest design is a far superior option. Here’s why… Life span: Instead of a thinner walled nozzle tip that you’ll...
by Jeff Zopff | Dec 3, 2014 | Blog
December 3, 2014 – Semiconductor packaging has traditionally followed dedicated equipment sets for given package formats or processes dictated by Bare Die or Flip Chip assembly. New Package Functionality, Performance, Miniaturization, Low cost materials are...
by Jeff Zopff | Nov 25, 2014 | Blog
November 25, 2014 – In order to improve competitive position, manufacturers must first understand if they are getting the most out of their equipment set. The best way to do this is to first designate a production team to measure performance and understand where...
by Jeff Zopff | Nov 3, 2014 | Blog
November 3, 2014 – Universal Instruments’ AREA Consortium has linked meetings with the IPC PERM Council this time around to encourage synergistic research opportunities between the two organizations. PERM members that will participate in this joint meeting...
by Jeff Zopff | Oct 30, 2014 | Blog
October 30, 2014 – October 22nd 2014, Universal Instruments participated in the Intelligent Manufacturing Industry Development Forum at the China Circum-Bohai Electronics Manufacturing and Intelligent Automation Exhibition (CEIA) in Tianjin, China. Glenn Farris,...
