by Jeff Zopff | Sep 12, 2019 | APL News, Press Release
Industry-leading resource provides valuable insight for today’s most challenging electronics assembly processes. September 12, 2019 – Universal Instruments’ Advanced Process Lab (APL) will be exhibiting on Booth #1215 at the SMTA International 2019 Exhibition in...
by Jeff Zopff | Jun 20, 2019 | APL News
At the close of each academic year, the Cornell Materials Science and Engineering department (MSE) hosts an awards dinner, inviting a broad spectrum of its students who are actively involved in materials research – including undergraduate, M.Eng, M.S., and Ph.D....
by Jeff Zopff | Jun 20, 2019 | APL News
Aware of the scope of APL joining research for microelectronics packaging applications, Finetech has selected the FINEPLACER® Pico ma bonding system for installation in the UIC advanced process laboratory. The Pico is a versatile bonding platform suitable for a wide...
by Jeff Zopff | Jun 20, 2019 | APL News
Graduate student interns in the Advanced Process Laboratory are given a broad exposure to many timely topics in assembly materials, electronics manufacturing and interconnect reliability. More importantly, their individual research assignment provides them an in-depth...
by Jeff Zopff | Jun 20, 2019 | APL News
High-voltage or high-frequency applications can be intolerant of flux residues remaining on the assembled board surface and so will often be specified as a water wash solder paste assemblies. The recently installed APL Aquastorm 50 is most often configured for a...
by Jeff Zopff | Apr 11, 2019 | APL News
Recognizing the growing need for higher power capability device interconnects, high-end device manufacturers are exploring the possibility of all copper interconnects. Electromigration-resistant copper interconnects can be made using a flip chip dipping process with a...
