by Jeff Zopff | Apr 14, 2022 | Press Release
Pioneering semiconductor solution to help cultivate the next generation of advanced packaging engineers. April 14, 2022 – Universal Instruments held a ribbon-cutting ceremony for Binghamton University’s acceptance of the company’s High-Speed Wafer Feeder (HSWF)...
by Jeff Zopff | Jan 6, 2022 | Press Release
Highly regarded manufacturers’ representative enriches customer experience in Midwest region. January 6, 2022 – Universal Instruments has strengthened its upper Midwest US customer coverage with the appointment of B.R. Peterson Associates as its Channel Partner...
by Jeff Zopff | Dec 1, 2021 | Press Release
Pioneering solution enables efficient volume manufacturing for complex multi-die devices. December 1, 2021 – Universal Instruments will exhibit on Booth 1031 at the SEMICON West trade show in San Francisco, CA on December 7–9. On the booth, Universal will...
by Jeff Zopff | Oct 18, 2021 | APL News, Press Release
Knowledge-sharing event strengthens relationships, improves supply chain efficiencies. June 4, 2020 – Universal Instruments brought its supplier base together at an informal and collaborative Supplier Day at its Conklin, NY, USA headquarters. The single-day...
by Jeff Zopff | Jun 26, 2021 | Events
Visit Universal on Booth 3007 San Francisco, CA December 7–9, 2021 Official Show Site