by Jeff Zopff | May 1, 2014 | Press Release
Versatile platform portfolio extends capabilities to deliver cost-effective performance for a full range of application challenges April 25, 2014 – Universal Instruments will display its Fuzion® Platform at the SMT Hybrid Packaging trade show May 6–8 at the...
by Jeff Zopff | Apr 25, 2014 | Press Release
Martin Anselm, Ph.D., Manager, Universal Instruments’ APL AREA Consortium, will examine the accelerated integration of new materials and components, and the challenges this poses for reliability testing April 25, 2014 – Universal Instruments’ Advanced Process...
by Jeff Zopff | Apr 18, 2014 | Press Release
Portfolio of cost-effective, high-performance odd-form solutions transforms back-end manual assembly challenges into a strategic advantage April 18, 2014 – Universal Instruments will showcase its automated odd-form assembly solutions at the 2014 NEPCON Shanghai...
by Jeff Zopff | Apr 9, 2014 | Press Release
For the second consecutive year, US-based contract manufacturer Silicon Mountain has closed a deal for a Universal Instruments Fuzion® Platform solution at the IPC APEX EXPO. April 9, 2014 – Universal Instruments again enjoyed a very successful IPC...
by Jeff Zopff | Mar 21, 2014 | Press Release
Industry’s broadest range of fully integrated technologies and exclusive expertise enable powerful, flexible solutions for all electronics manufacturing environments. March 21, 2013 – Universal Instruments will display its comprehensive portfolio of solutions...
