by Jeff Zopff | Aug 19, 2014 | Blog
August 18, 2014 – Universal Instruments is going to hold a China market-focused seminar at NEPCON Shenzhen on August 26 & 27, in Rose Hall #2, 5th floor, Shenzhen Convention Center, and the Advanced Process Laboratory (APL) will present the precise and...
by Jeff Zopff | Aug 17, 2014 | Blog
August 17, 2014 – Universal Instruments’ Dr. Babak Arfaei is going to present “Effect of Sn Grain Morphology on Reliability of Lead Free Solder Joints in Thermal Cycling Tests” on August 25 at iNEMI Workshop on Board Assembly & Test Technology in Shenzhen,...
by Jeff Zopff | Aug 4, 2014 | Blog
August 1, 2014 – It has been more than 5 years when the first generation of Package-on-Package came into form. The primary objective is to combine the memory and the application specific integrated circuit (ASIC) to use much lesser real property this shrinking...
by Jeff Zopff | Jul 24, 2014 | Blog
July 24, 2014 – It is not just another robotic platform that can handle the rigors of inserting small to large, light to heavy odd-form components. The platform must have the flexibility to use gripper tooling or vacuum nozzles and sometimes both. And the...
by Jeff Zopff | Jul 21, 2014 | Blog
July 21, 2014 – The old saying ‘garbage in – garbage out’ can apply directly to this initial process in the assembly of SMT assemblies. Stencils designed without regard to materials, pad design and part geometry will create poor yields and needless rework....
