by Jeff Zopff | Oct 2, 2014 | Events
2014 MEPTEC Semiconductor Packaging Technology Symposium Santa Clara, CA October 23, 2014 Table 8 http://meptec.org/meptec2014semico.html
by Jeff Zopff | Sep 30, 2014 | Blog
September 30, 2014 – Component packaging is the single most important issue to take into account when considering automation for odd-form factor components. The electronics industry is pretty unique in that the majority of components are regulated by a...
by Jeff Zopff | Sep 25, 2014 | Blog
September 25, 2014 – The APL’s AREA Consortium will present four papers at the SMTAi technical conference. In session on Oct 1, Dr. Martin Anselm is going to talk about Component Warpage: Issues with Measurement and Standardization. In the Lead-Free Symposium on...
by Jeff Zopff | Sep 25, 2014 | Events
Universal’s APL to Exhibit at SMTAi 2014 September 30–October 1, 2014 Booth #641 & Table #6 at the High Temperature Experience (Exhibition) Session SMT6, Oct 1 & Session LF1, Oct 2 (Technical Conference)
by Jeff Zopff | Sep 25, 2014 | APL News, Press Release
Advanced process expertise enables manufacturers to quickly bring concepts and prototypes to reality September 25, 2014 – Universal Instruments will be exhibiting on Booth #641 at the SMTA International 2014 exhibition in Rosemont, IL, on September 30 – October...
