by Jeff Zopff | Oct 14, 2014 | Events
CEIA Tainjin 2014 Tianjin Binhai International Convention & Exhibition Center Presentation: SMT Process Controls and Solutions October 22nd, 11:30am–12:00pm Booth 7-C20, Electronics Manufacturing Technology Forum...
by Jeff Zopff | Oct 10, 2014 | Blog
October 10, 2014 – While it may seem unusual to discuss mechanics in an electronics-oriented document, the success of automating odd-form components hinges on the stability of the mechanics of the component. Of course it is the geometry of the component related...
by Jeff Zopff | Oct 6, 2014 | Blog
October 6, 2014 – Lead-to-hole ratio is the amount of variance between the largest diameter/diagonal of the lead to the smallest diameter of the hole. This factor has to be considered in the determination of viability for automation. There are so many factors...
by Jeff Zopff | Oct 2, 2014 | Events
2014 MEPTEC Semiconductor Packaging Technology Symposium Santa Clara, CA October 23, 2014 Table 8 http://meptec.org/meptec2014semico.html
by Jeff Zopff | Sep 30, 2014 | Blog
September 30, 2014 – Component packaging is the single most important issue to take into account when considering automation for odd-form factor components. The electronics industry is pretty unique in that the majority of components are regulated by a...
