by Jeff Zopff | Oct 6, 2014 | Blog
October 6, 2014 – Lead-to-hole ratio is the amount of variance between the largest diameter/diagonal of the lead to the smallest diameter of the hole. This factor has to be considered in the determination of viability for automation. There are so many factors...
by Jeff Zopff | Oct 2, 2014 | Events
2014 MEPTEC Semiconductor Packaging Technology Symposium Santa Clara, CA October 23, 2014 Table 8 http://meptec.org/meptec2014semico.html
by Jeff Zopff | Sep 30, 2014 | Blog
September 30, 2014 – Component packaging is the single most important issue to take into account when considering automation for odd-form factor components. The electronics industry is pretty unique in that the majority of components are regulated by a...
by Jeff Zopff | Sep 25, 2014 | Blog
September 25, 2014 – The APL’s AREA Consortium will present four papers at the SMTAi technical conference. In session on Oct 1, Dr. Martin Anselm is going to talk about Component Warpage: Issues with Measurement and Standardization. In the Lead-Free Symposium on...
by Jeff Zopff | Sep 25, 2014 | Events
Universal’s APL to Exhibit at SMTAi 2014 September 30–October 1, 2014 Booth #641 & Table #6 at the High Temperature Experience (Exhibition) Session SMT6, Oct 1 & Session LF1, Oct 2 (Technical Conference)
