by Jeff Zopff | Oct 20, 2014 | Press Release
Process expertise complements mature and versatile technologies to address diverse packaging and assembly requirements October 20, 2014 – Universal Instruments will be exhibiting on Table #8 at the 2014 MEPTEC Semiconductor Packaging Technology Symposium in...
by Jeff Zopff | Oct 16, 2014 | Blog
October 16, 2014 – When I meet people in the electronics industry and tell them I am the Marketing Manager for through-hole products at Universal Instruments, they almost always say “You still sell those machines? I thought through-hole technology is DEAD”. I...
by Jeff Zopff | Oct 14, 2014 | Blog
October 14, 2014 – Pad cratering occurs when there is a break within the resin between the copper foil and outermost layer of fiberglass of a PCB (cohesive), or at the resin-to-glass interface (adhesive). The pad is separated from the PCB, leaving a crater on...
by Jeff Zopff | Oct 14, 2014 | Events
CEIA Tainjin 2014 Tianjin Binhai International Convention & Exhibition Center Presentation: SMT Process Controls and Solutions October 22nd, 11:30am–12:00pm Booth 7-C20, Electronics Manufacturing Technology Forum...
by Jeff Zopff | Oct 10, 2014 | Blog
October 10, 2014 – While it may seem unusual to discuss mechanics in an electronics-oriented document, the success of automating odd-form components hinges on the stability of the mechanics of the component. Of course it is the geometry of the component related...
