by Jeff Zopff | Jan 7, 2015 | Blog
[section background_repeat=”repeat” background_position=”center top” background_attachment=”static” background_scroll=”none”] January 6, 2015 – Imagine for example, combining active die components, WLCSPs, uBGAs...
by Jeff Zopff | Dec 11, 2014 | Blog
December 11, 2014 – You might ask, “What’s the difference between this nozzle and the older conical 0402 ceramic nozzle?” Simply put, we think this latest design is a far superior option. Here’s why… Life span: Instead of a thinner walled nozzle tip that you’ll...
by Jeff Zopff | Dec 3, 2014 | Blog
December 3, 2014 – Semiconductor packaging has traditionally followed dedicated equipment sets for given package formats or processes dictated by Bare Die or Flip Chip assembly. New Package Functionality, Performance, Miniaturization, Low cost materials are...
by Jeff Zopff | Nov 25, 2014 | Blog
November 25, 2014 – In order to improve competitive position, manufacturers must first understand if they are getting the most out of their equipment set. The best way to do this is to first designate a production team to measure performance and understand where...
by Jeff Zopff | Nov 17, 2014 | APL News, Press Release
Cooperative meeting encourages synergistic research opportunities between two leading organizations November 17, 2014 – On November 4-6, Universal Instruments hosted a collaborative meeting with the IPC PERM Council and Universal’s Advanced Process Lab (APL)...
