by Jeff Zopff | May 29, 2015 | APL News
Pb-free research results shared with peers at May 27 event. May 29, 2015 – Metallurgical observations from our alternate Pb-free solder evaluation program were shared with the CPMT electronic packaging community at the 65th Electronic Components & Technology...
by Jeff Zopff | May 21, 2015 | Blog
May 21, 2015 – The Advanced Process Laboratory of Universal Instruments may be the diamond in the tiara of the company. Operating as an independent business with labs in Binghamton, NY and Shanghai, China, the APL delivers several distinct offerings to its...
by Jeff Zopff | May 6, 2015 | Press Release
Industry experience and technical expertise enriches Universal’s ability to exceed customer expectations in US southern states. May 6, 2015 – Universal Instruments is pleased to announce the appointment of Michael Welch as Southern States Regional Manager of...
by Jeff Zopff | Apr 27, 2015 | Events
Universal Automates Success at SMT Hybrid Packaging 2015 May 5-7, 2015 Exhibition Centre Nuremberg Nuremberg, Germany Visit us on Hall 7 Stand 7-221 Official Show Website
by Jeff Zopff | Apr 27, 2015 | Press Release
Flexible technology lineup enables winning formula for automating contemporary odd-form challenges. April 27, 2015 – Universal Instruments will display two solutions from its automated odd-form assembly portfolio at the SMT Hybrid Packaging trade show to be held...
