by Jeff Zopff | Feb 2, 2017 | Press Release
AdvantisV™ combines the best in technology and performance with a low entry price and unmatched scalability. February 2, 2017 – Universal Instruments will unveil a new midrange addition to its industry-leading platform portfolio on booth 827 at the 2017 IPC APEX...
by Jeff Zopff | Nov 28, 2016 | Events
Visit Universal on Booth #827 San Diego Convention Center San Diego, CA February 14–16, 2017 Official Show Site
by Jeff Zopff | Oct 11, 2016 | Press Release
Unique architecture enables the first true volume solution for today’s consumer demands. October 11, 2016 – Universal Instruments’ Flexbond™ hot bar bonding platform was presented the Global SMT & Packaging Global Technology Award at the 2016 SMTA...
by Jeff Zopff | Sep 29, 2016 | Press Release
Newly refurbished facility to showcase automation solutions and deliver comprehensive services. September 29, 2016 – Universal Instruments recently held a celebration ceremony to mark the grand opening of its Asia Advanced Technology Center in Shanghai with the...
by Jeff Zopff | Sep 21, 2016 | APL News, Press Release
Complementary technology and process solutions provide foundation for lasting profitability. September 21, 2016 – Universal Instruments will exhibit on Booth #807 at the SMTA International 2016 Exhibition in Rosemont, IL, on September 27–28, demonstrating its...
