by Jeff Zopff | Jun 20, 2019 | APL News
High-voltage or high-frequency applications can be intolerant of flux residues remaining on the assembled board surface and so will often be specified as a water wash solder paste assemblies. The recently installed APL Aquastorm 50 is most often configured for a...
by Jeff Zopff | May 15, 2019 | Press Release
Leading-edge platform delivers high-mix productivity by streamlining and even eliminating changeovers. May 15, 2019 – Assembly Technologies Inc. (ATI), an electronics manufacturing services provider with more than 30 years of experience, has added a Universal...
by Jeff Zopff | Apr 11, 2019 | APL News
Recognizing the growing need for higher power capability device interconnects, high-end device manufacturers are exploring the possibility of all copper interconnects. Electromigration-resistant copper interconnects can be made using a flip chip dipping process with a...
by Jeff Zopff | Apr 11, 2019 | APL News
AREA consortium assembly research is executed for the benefit of our member companies with all results and supporting data archived for on-demand access by the membership. Key observations are routinely selected from this growing archive for sharing with the industry...
by Jeff Zopff | Apr 11, 2019 | APL News
BTU International installed the first of its Pyramax Vacuum reflow oven product line in the APL for solder reflow studies to be shared with AREA consortium members. This oven operates like a standard convection reflow oven but includes an automated vacuum chamber in...
