by Jeff Zopff | Jun 20, 2019 | APL News
Graduate student interns in the Advanced Process Laboratory are given a broad exposure to many timely topics in assembly materials, electronics manufacturing and interconnect reliability. More importantly, their individual research assignment provides them an in-depth...
by Jeff Zopff | Jun 20, 2019 | APL News
High-voltage or high-frequency applications can be intolerant of flux residues remaining on the assembled board surface and so will often be specified as a water wash solder paste assemblies. The recently installed APL Aquastorm 50 is most often configured for a...
by Jeff Zopff | May 15, 2019 | Press Release
Leading-edge platform delivers high-mix productivity by streamlining and even eliminating changeovers. May 15, 2019 – Assembly Technologies Inc. (ATI), an electronics manufacturing services provider with more than 30 years of experience, has added a Universal...
by Jeff Zopff | Apr 11, 2019 | APL News
Recognizing the growing need for higher power capability device interconnects, high-end device manufacturers are exploring the possibility of all copper interconnects. Electromigration-resistant copper interconnects can be made using a flip chip dipping process with a...
by Jeff Zopff | Apr 11, 2019 | APL News
AREA consortium assembly research is executed for the benefit of our member companies with all results and supporting data archived for on-demand access by the membership. Key observations are routinely selected from this growing archive for sharing with the industry...
