sOLUTIONS
PRECISION AUTOMATION SOLUTIONS
Applications requiring high-accuracy alignment, flex handling, cutting and forming. May combine inspection, placement and bonding technologies.
ADVANCED PACKAGING SOLUTIONS
2D, 2.5D and 3D semiconductor applications requiring high accuracy and efficient die handling. From direct die and flip chip to multi-die heterogeneous integration.
PCB ASSEMBLY SOLUTIONS
Traditional printed circuit board assembly, including standard surface mount placement and through-hole component insertion.
SOLUTIONS
Our global customer base employs a wide range of processes and technologies to build some of the best products in the world. Universal’s years of experience and applications knowledge coupled with the industry’s broadest technology portfolio enables us to provide solutions that help our customers build better.
PRECISION AUTOMATION SOLUTIONS
Applications requiring high-accuracy alignment, flex handling, cutting and forming. May combine inspection, placement and bonding technologies.
- Large & high-part count PCB & SSD modules: OFA for Server/Network Infrastructure; DIMM sockets, high-pin-count connectors; SSD e-cap form/cut/insert
- IoT, High-Reliability Industrial, Medical & Mil-Aero PCB & modules: OFA, including high-pin-count connectors. Flex-flex or flex-PCB place & hot bar bonding
- Mobility (Phone, Watch, Earbud) modules: Hot bar & laser bonding: flex-flex, SiP, flex-optic; MP sensor
- Automotive, Lighting & Sensing modules: IGBT module assembly, Lidar, MEMS, HL module assembly
PRECISION AUTOMATION PRODUCTS
FUZION
EXTREME SM & ODD-FORM
Fuzion® offers a flexible, high-speed platform solution with plug-and-play adaptability for specialized application-specific tooling. Build your most challenging products with precise, repeatable closed-loop processes – and confidence.
FUZIONSC & HSWF
HIGH-SPEED, MULTI-DIE ADVANCED PACKAGING
FuzionSC™ and the HSWF™ combine to bring high productivity to advanced packaging assembly, delivering precision passive and active placement on a single platform. This solution supports virtually any feeding option and has the performance to meet high-volume targets.
FUZIONOF
TRADITIONAL SM & ODD-FORM
FuzionOF™ is easily configured for SM or odd-form applications, performing both component placement and insertion. It is ideal for light-duty odd-form, supporting a wide range of leaded and non-leaded odd-form devices.
UFLEX
FLEXIBLE MULTI-PROCESS AUTOMATION
Uflex™ delivers ultimate flexibility for all forms of odd-form insertion and mechanical assembly operations. It supports radial and axial insertion and provides passive and active clinching. Uflex is easily retooled for a variety of processes, including screw driving, labeling, test handling, and more.
OMNI INSERTER
SIMPLIFIED INSERTION
The Omni Inserter is the first offering from the new Value Series, bringing intelligence, ease of use and simplicity to back-end electronics assembly automation. It enhances the component range of Uflex and FuzionOF, enabling a complete cost-effective solution for any automation requirement.
APPLICATION VIDEOS
COMPLEX CONNECTOR ASSEMBLY
ODD-FORM AUTOMATION
HIGH PIN-COUNT MODULE ASSEMBLY
ADVANCED PACKAGING SOLUTIONS
2D, 2.5D and 3D semiconductor applications requiring high accuracy and efficient die handling. From direct die and flip chip to multi-die heterogeneous integration.
- Large & high-part count electronics: HPC die to substrate flip chip, HPC die on die POP, HPC die on wafer CoWoS
- IoT, Hi-Reliability Industrial, Medical & Mil-Aero modules: Multi-die flip chip sensor assembly, MEMS sensor module assembly, Die on flex & embedded die assembly
- Mobility (Phone, Watch, Earbud) modules: Heterogeneous Integration, wafer and panel fan-out, die on flex and embedded die
- Automotive modules: IGBT die on substrate assembly, Lidar & MEMS module assembly, HL LED on substrate assembly
ADVANCED PACKAGING PRODUCTS
FUZIONSC & HSWF
HIGH-SPEED, MULTI-DIE ADVANCED PACKAGING
FuzionSC™ and the HSWF™ combine to bring high productivity to advanced packaging assembly, delivering precision passive and active placement on a single platform. This solution supports virtually any feeding option and has the performance to meet high-volume targets.
FUZIONSC & FLEXION
EFFICIENT SINGLE-DIE ADVANCED PACKAGING
FuzionSC™ and the Flexion™ direct die feeder support a full complement of high-volume flip chip and bare die applications. Flexion enables high-speed die delivery from wafer over a wide range of die sizes to streamline processes and improve efficiency.
FLEXBOND
AUTOMATED VOLUME HOT BAR BONDING
The Flexbond™ high-throughput hot bar bonding platform enables the first fully automated volume solution for advanced flex circuit and other hot bar interconnect applications. It combines Fuzion® for full-process integration, including flux transfer, high-accuracy placement and hot bar soldering.
APPLICATION VIDEOS
HETEROGENEOUS INTEGRATION
FLEXBOND OPERATION
PANEL FAN-OUT
PCB ASSEMBLY SOLUTIONS
Traditional printed circuit board assembly, including standard surface mount placement and through-hole component insertion.
- Large & high-part count PCBA: Server/Network Infrastructure SMT
- IoT, Hi-Reliability Industrial, Medical & Mil-Aero PCBA: High-changeover SMT & NPI
- Mobility (Phone, Watch, Earbud) PCBA: End-of-line multifunction for MLB, interposers, antenna
- Automotive, Lighting: High-changeover SMT & NPI
PCB ASSEMBLY PRODUCTS
GENERATION 88HTi
TRADITIONAL THROUGH-HOLE
Dedicated to pre-taped radial and axial components, the Radial 88HTi™ and VCD 88HTi™ bring a new level of productivity to radial and axial component sequencing and insertion, offering consistently high throughput.
FUZION
HIGH-PERFORMANCE SURFACE MOUNT
Fuzion® is the pinnacle of platform performance, providing an agile, flexible production model without limitations. Fuzion is the industry’s most adaptable and capable platform, delivering profitable productivity for any manufacturing model from NPI to ultra-high volumes.
FUZIONOF
TRADITIONAL SURFACE MOUNT & ODD-FORM
FuzionOF™ is easily configured for SM or odd-form applications, performing both component placement and insertion. It is ideal for light-duty odd-form, supporting a wide range of leaded and non-leaded odd-form devices.
UFLEX
FLEXIBLE MULTI-PROCESS AUTOMATION
Uflex™ delivers ultimate flexibility for all forms of odd-form insertion and mechanical assembly operations. It supports radial and axial insertion and provides passive and active clinching. Uflex is easily retooled for a variety of processes, including screw driving, labeling, test handling, and more.
OMNI INSERTER
SIMPLIFIED INSERTION
The Omni Inserter is the first offering from the new Value Series, bringing intelligence, ease of use and simplicity to back-end electronics assembly automation. It enhances the component range of Uflex and FuzionOF, enabling a complete cost-effective solution for any automation requirement.