AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2024 MEETINGS

OCTOBER MEETING

 
AUTHOR PRESENTATION
  Agenda
Jim Wilcox Welcome / Introduction
Jeff Kurish Further Investigation of Double Reflow BGA with Stacked Microvias
Mohammed Abdel Razzaq FEM Investigation of BGA Solder Joint Residual Stress as a Function of Solidification Temperature
Chris Gastaldo Alternative Methods to Measuring BGAs for Thermal Warpage
Joseph Brown Vibration Fatigue and Shear Strength of High Reliability Solder Alloys
Michael Meilunas Thermal Cycle Reliability Update:  Hybrid Solder Assemblies Using High Reliability Solder Pastes
Alyssa Yaeger Dynamic Alloying of Solder Joints in Low Temperature Solder Assembly of Resistors
Paul Paret Reliability Evaluation of High-Temperature Bonded Interfaces for Automotive Power Electronics
Jeff Kurish Thermal Imaging via Laser Flash Analysis with Spatial Resolution
Piyush Kulkarni Vacuum Reflow of Solder Thermal Interface Materials:  Thermal Cycle Stability
Michael Meilunas Low Temperature Solder Thermal Cycle Experiments with ‘Moderate’Electromigration Stressing
Alyssa Yaeger Effect of Temperature and Current Stress on Thermal Cycling Performance of Low Temperature Solder Alloys
Alyssa Yaeger Explorations in Electromigration Testing
Peter Borgesen Interactions Between Cyclic Loading and Electromigration in SAC305 Solder Joints
Michael Meilunas Low Temperature Solder Current Stressing Effects on Drop Test Performance 2022-2024 Wrap-Up

 

MAY MEETING

 
AUTHOR PRESENTATION
  Agenda 
Jim Wilcox Welcome / Introduction 
Martin Anselm Thermal Cycle Performance of Hybrid Low Temperature Solder Joints Tested at a High Homologous Temperature
Nithin Lakshminarayan  Temperature Dependence of Solder Joint Vibration Lifetime Testing 
Piyush Kulkarni Capacitance based Measurements for TIM2 Stability Analysis
Ali Davoodabadi Solder Thermal Interface Process Optimization    
Ali Davoodabadi Thermal Imaging for TIM Evaluation during Power Cycling
Christopher Soles NIST CHIPS Packaging Metrology Overview
Ran Tao What’s Missing in Your Cure Kinetics Model for Advanced Packaging Materials?
Jeff Kurish Double Reflow BGA Defects with Stacked Microvias
Michael Meilunas Accelerated Thermal Cycle Testing Observations 
Joseph Brown and Alyssa Yaeger Embrittlement Due to Gold Surface Finishes in SnPb Joints
Nancy Wang and Alyssa Yaeger Copper Diffusion and Oxidation as a Measure of Shelf-Life and Thermal Stability
Jeff Kurish Laser Reflow Thermal Limitations
Michael Meilunas Test Component Quality Concerns:  An Open Discussion
Alyssa Yaeger High Reliability Solder Device Shear Strength with an Aluminum Clad PCB
Sufyan Tahat  Cyclomax (SAC-Q) Drop Shock Performance
Michael Meilunas High Reliability Hybrid Solder Joints—Preliminary Trials
Peter Borgesen Optimizing Reliability of Solder Joints Reflowed near or below 140C
Alyssa Yaeger Effect of Electromigration Pre-Stress on Thermal Cycle Lifetime
Michael Meilunas Current Stress Effects on Drop Shock Performance of SnBi Low Temperature Solder Joints