AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2023 MEETINGS

OCTOBER MEETING

 
AUTHOR PRESENTATION
  Agenda 
Jim Wilcox Welcome/Introduction
Ali Davoodabadi Solder Thermal Interface Material (sTIM):  Processing and Reliability Analysis
Sara Makarem Laser Probe Techniques for Bulk and Interface Thermal Conductivity Measurement
Ali Davoodabadi Thermal Imaging for Direct Observation of TIM Stability under Power Cycling
Ali Davoodabadi Liquid-Metal-Filled Polymer Performance and Stability:  TIM1.5 vs. TIM1
Alyssa Yaeger and Joseph Brown Ni-Less ENIG Premium Surface Finish Evaluation
Alyssa Yaeger Further Durafuse-LT Evaluation
Carol Handwerker Solder Performance and Reliability Assurance Project:  A Pathway to Defense Modernization
Michael Meilunas Understanding Component Behavior and Its Effect on Solder Alloy Reliability in Thermal Cycling
Alyssa Yaeger Automotive Alloy Thermal Cycle Reliability
Michael Meilunas Low Temperature Solder (LTS) Current Stressing and Drop Testing
Sufyan Tahat Solder Joint Height Effect on Drop Testing Performance – SAC305
Nithin Lakshminarayan Vibration Testing of LTS B37 Solder Alloy
Alyssa Yaeger Effect of Current Stress on SnBi Thermal Cycle Reliability
Sai Kiran Reddy Munnangi Optimizing Reliability of Solder Joints Reflowed at Temperatures Below 140C

APRIL MEETING

 
AUTHOR PRESENTATION
  Agenda 
Jim Wilcox Welcome/Introduction 
Glenn Farris Introduction to the New Universal Instruments 
Manian Ramkumar  and Madhu Stemmermann Novel Anisotropic Interconnect for Solder, ACA and ACF Replacement (ZTACH® ACE) 
Alyssa Yaeger SnBi Thermal Cycle Reliability During Current Stress 
Michael Meilunas Drop Test Performance of Low Melt Solder BGAs 
Peter Borgesen Complementing Accelerated Thermal Cycle Reliability Testing of Solder Joints with Mechanical Shear Tests 
Boyi Zhang, Yu-Hsuan Tsai, Peter Barbosa Package Development of SiC Power Electronics Modules for EV Applications 
Alyssa Yaeger Evaluation of Transient Liquid Phase Sintering (TLPS) Paste 
Ali Davoodabadi Liquid Metal Composite TIM Performance and Stability Analysis 
Peter Hopkins Optical Pump-probe Measurements of Thermal Conductivity and Thermal Resistance of Thin Films, Interfaces and Packages 
Ali Davoodabadi Thermal Imaging for Direct Observation of TIM Stability under Power Cycling 
Ali Davoodabadi Evaluating the Reliability of Solder Thermal Interface Material (STIM) 
Michael Meilunas Thermal Shock vs. Thermal Cycle of Alternate “High Reliability” Alloys 
Norman Armendariz Real-time X-ray Video Imaging of Ph-Free Solder Pastes under Simulated SMT Reflow