AREA CONSORTIUM MEETINGS
AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.
2022 MEETINGS
OCTOBER MEETING |
|
| AUTHOR | PRESENTATION |
| Agenda | |
| Jim Wilcox | Welcome |
| Peter McClure | DSC Examination of BiSn Low Melt Solder with SnAgCu |
| Alyssa Yaeger | Durafuse™ LT Solder Assembly: Early Observations |
| Mohamed Belhadi | Creep Strength of High Reliability Solders in Thermal Cycle |
| Peter McClure | Direct Observation of Thermal Interface Performance |
| Peter McClure | Thermal Interface Material (TIM2) Reliability Test Update |
| Eric Cotts | BiSn Solder under Current Stress: Bi Accumulation and Variability |
| Alyssa Yaeger | Low Temperature Solder ATC with Current Stress |
| Michael Meilunas | BiSn Solder Drop Shock Degradation with Current Stress |
| Peter Borgesen | Sintered Copper Interconnects |
| Jingwei Xian and Chrisopher Gourlay | Crystallographic Investigation of Hybrid LTS Solder Ball Drift |
| Saikumar Jayaraman and John Sotir | Intel Heterogeneous Integration Prototype (SHIP) Facility |
| Faramarz Hadian | Thermal Cycle Fatigue Acceleration with SnBi Solder Joints |
| Michael Meilunas | ATC Reliability Testing Update |