AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2021 MEETINGS

OCTOBER MEETING

 
AUTHOR PRESENTATION
  Agenda
Jim Wilcox Welcome 
Michael Meilunas REL20B. Thermal Stability of Electrolytic Capacitors
Michael Meilunas REL20A. Multilayer Ceramic Capacitor Cracking Evaluation
Michael Meilunas MAT2D. Pad Cratering Resistance of Cap Layer Laminates
Pericles Kondos MAT1C. Component Edge Bonding:  Process and Reliability
Michael Meilunas MAT7H. Low Temperature Solder Reliability:  ATC Performance
Dylan Richmond APD11A. BGA Pad Repair using Aerosol Jet Printing
Jim Wilcox, Mohammad Gharabeih, Luke Wentlent REL2B. Drop Shock Modeling:  Effect of Solder Joint Geometry
Jim Wilcox, Michael Meilunas REL10C. Drop Shock Behavior of Hybrid Low Temperature Solder Joints
Ted Jones Qorvo — SHIP-RF Overview (Heterogeneous Integration Packaging prototype facility)
Michael Meilunas REL8B. Underfilled WLCSP Reliability (No-Clean Assembly)
Pericles Kondos MAT3A. “Ni-less ENIG Premium” Surface Finish Evaluation
Christopher Gourlay, Jingwei Xian REL11C. Crystallographic Investigation of Hybrid LTS Ball Drift
Eric Cotts, Faramarz Hadian, Javier Flores, Sitaram Panta REL18B. Current Stressing in Near Eutectic BiSn Low Temperature Solder Alloys
Pericles Kondos MAT6C. Heraeus DA320 Silver Sinter Paste
Peter McClure MAT4D. Liquid Metal Thermal Interface Stability
Peter McClure MAT4E. Thermal Interface Material Testing Apparatus

MARCH MEETING

 
AUTHOR PRESENTATION
  Agenda
Jim Wilcox Welcome/Introduction
Michael Meilunas MAT2D. Laminate Pad Cratering Analysis using Monotonic Bend Test
 Luke Wentlent, Tian Sang REL10C. Solder Alloy Drop Shock Performance
Michael Meilunas MAT3B. Reliability of Electrolytic Pd, Autocatalytic Au (EPAG) Surface Finish
Luke Wentlent, Michael Meilunas MAT7H. Low Temperature Solder Reliability:  0/100C ATC Performance and ATC Profile Effects
Peter McClure, Dylan Richmond MAT4B.  Graphite Thermal Pad Reliability Testing
Peter McClure REL17A.  Interval Testing TIMs in ATC — Experimental Design and Debug
Eckardt Bihler Dyconex — Reliability and Biostability of Bio-Electronic Implants
Pericles Kondos MAT4D.  Liquid Metal Thermal Interface Material Processing
Jan Gilldorf Saab — Solderability and Wetting of Immersion Tin Finish
Faramarz Hadian, Eric Cotts Electromigration in Homogeneous Near Eutectic BiSn Solder Joints
Luke Wentlent MAT7A.  Thermal Cycle Dwell Time Effects in High Reliability Solders
Pericles Kondos, Xinyu Zhang MAT1C.  Component Edge Bonding:  Process and Reliability
Pericles Kondos, Xinyu Zhang MAT1C.  Component Edge Bonding:  Rework Process Trials
Pericles Kondos REL9A.  PCB Thermal Response of Mixed VIPPO BGA Array