AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2020 MEETINGS

OCTOBER MEETING

 
AUTHOR PRESENTATION
  Agenda
Jim Wilcox Welcome/Introduction
Jeff Kurish MAT4C – Thermal Cycle Testing of Thermal Grease Materials
Mohammed Abdel Razzaq MAT4B – Electrical Resistance Monitoring of Graphite Thermal Pads in ATC
Chris Gastaldo MAT4D – Gallium-Indium Liquid Metal Thermal Interface Studies
Joseph Brown MAT6C – Semi-Sintering Silver Paste
Michael Meilunas Screen Printed Ink Circuitry – Optimizing Resolution
Alyssa Yaeger MAT1C – Component Edge Bonding: Process and Reliability
Paul Paret REL17A – Effect of Current Stress on near Eutectic SnBi Solder Joints
Jeff Kurish HP Labs – 3D Printed Electronics with Multi Jet Fusion
Piyush Kulkarni MAT7F – Low Temperature Solder Joint Mechanical Behavior
Michael Meilunas MAT7H – Thermal Cycle Reliability of BiSn Solder Interconnects
Alyssa Yaeger REL17B – Low Temperature Solder Reliability Failure Mechanisms
Alyssa Yaeger MAT7A – High Performance Solder Alloys: Dwell Time Studies
Peter Borgesen REL10B – High Performance Solder Alloys: Drop Shock
Michael Meilunas REL3E – High Performance Solder Alloys: Vibration
Michael Gaynes, Michael Meilunas REL15B – Power Cycle Reliability Testing (QFN, BGA)

MARCH MEETING

 
AUTHOR PRESENTATION
  Agenda
Jim Wilcox Welcome/Introduction
Luke Wentlent MAT7F. Microstructure Observations in As-Reflowed SnBi Mixed Solder Joints
Faramarz Hadian, et al. REL17A. Effects of Current Stress on the Microstructure of SnBiAg-SAC Mixed Solder Joints
Michael Meilunas and Luke Wentlent MAT7I. Low Temperature Solder Thermal Cycle Reliability Testing and Failure Mechanisms
Luke Wentlent MAT7F. Mechanical Behavior of Low Melt Mixed Assembly Joints
Michael Meilunas REL8A. ATC Reliability of Large Body WLCSP and SMT Devices on Low CTE PCB
Michael Meilunas MAT3B. PCB Surface Finishes: EPAG, ENIG, & Cu/OSP
Michael Meilunas REL18A. Failure Detection in Underfilled Components
Pericles Kondos MAT1C. Component Underfill and Edge Bonding Project Update
Peter McClure MAT4C. Thermal Cycle Testing of Thermal Grease and Phase Change Materials
Peter McClure MAT4E. Liquid Ga-In Die Level Thermal Interface Material — Initial Studies
Peter McClure APD3C. Copper Coin PCBs — Preliminary Reliability Evaluation
Luke Wentlent REL2B. High Performance Solder Alloy Studies: Thermal Shock and Dwell Time Effects
Richard Coyle Thermal Fatigue of High Performance Pb-Free Solder Alloys (iNEMI)
Luke Wentlent APD11B. Selected Area Laser Reflow of Temperature Sensitive Components
Pericles Kondos and Tian Sang REL9A. Mixed VIPPO BGA Array Solder Defects