by Jeff Zopff | Apr 11, 2019 | APL News
Recognizing the growing need for higher power capability device interconnects, high-end device manufacturers are exploring the possibility of all copper interconnects. Electromigration-resistant copper interconnects can be made using a flip chip dipping process with a...
by Jeff Zopff | Apr 11, 2019 | APL News
AREA consortium assembly research is executed for the benefit of our member companies with all results and supporting data archived for on-demand access by the membership. Key observations are routinely selected from this growing archive for sharing with the industry...
by Jeff Zopff | Apr 11, 2019 | APL News
BTU International installed the first of its Pyramax Vacuum reflow oven product line in the APL for solder reflow studies to be shared with AREA consortium members. This oven operates like a standard convection reflow oven but includes an automated vacuum chamber in...
by Jeff Zopff | Apr 11, 2019 | APL News
A unique APL thermal rod tester is routinely used to measure unit area thermal resistance and thermal conductivity of various thermal interface materials (TIMs) for AREA consortium members. Sample TIM bondlines of accurately controlled thickness are fabricated between...
by Kristi Schilloff | Apr 10, 2019 | Blog
Computer servers are critical for collecting and sending out data over various networks, whether local or widely spread networks in different locations. Servers connect to networks of 'clients' and feed them the information they need. A server computer can be...
