AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2019 MEETINGS

OCTOBER MEETING

 
AUTHOR PRESENTATION
  Agenda
Jim Wilcox Welcome / Introductions
Pericles Kondos MAT1C. BGA Capillary Underfill & Edge Bond Evaluation
Yujia Wang, Peter McClure MAT6H. Copper Sintering Studies
PJ Singh MAT8E. Conformal Coating Evaluations using Silver Thin Films
Peter McClure MAT4C. Board Level Thermal Interface Materials: Performance and Reliability
Tim Jensen MAT4D. Metal Die Level Thermal Interface Innovations
Peter McClure MAT4D. Indium TIM1 Characterization
Luke Wentlent MAT7F. Low Melt Solder Mixed Assembly Mechanical Reliability
Xuanyi Ding, Luke Wentlent MAT7F. Low Melt Solder Drop Shock Performance
Eric Cotts, Faramarz Hadian REL17A. Reflow and Current Stress Effects on SnBi Solder Joint Reliability
Luke Wentlent REL17B. SnBi Solder Reliability: High Current Thermal Cycle Test
Luke Wentlent MAT9B. Low Melt Solder Mixed Assembly: Thermal Cycle Reliability
Michael Meilunas MAT3B. EPAG Surface Finish Evaluation
Luke Wentlent MAT7A. High Reliability Solder Alloy Studies
Pericles Kondos REL9A. Mixed VIPPO BGA Array Solder Defects
Peter McClure APD3C. Copper Coin Board Assembly
Michael Meilunas REL8A. Low CTE Circuit Boards for Large Body WLCSP
Michael Meilunas REL3E. Alternate Solder Alloy Vibration Testing
Arad Azizi, Scott Schiffries 3D Printed Die Level Heatsinks by Selective Laser Melting

MARCH MEETING

 
AUTHOR PRESENTATION
  Agenda
Jim Wilcox Welcome/Introduction
Peter McClure MAT6H. Sintered Copper Joining
Eric Cotts MAT7F. Low-Melt BiSn Mixed Assembly: Effect of Reflow Temperature
Luke Wentlent MAT7F. Low-Melt BiSn Mixed Assembly: Mechanical and Microstructural Behavior
Pericles Kondos and Thaer Alghoul REL9A. Mixed VIPPO BGA Array Soldering Defects
Faramarz Hadian, Mohammed Genanu, Eric Cotts REL18A. BiSn Mixed Solder Electromigration
Douglas Hopkins Power Packaging Assembly Challenges
Pericles Kondos and Thaer Alghoul MAT1C. Capillary Underfill and Edge Bonding of BGA Components
Luke Wentlent MAT6G. High Reliability Solder Alloys: Effect of Bi Content
Michael Gaynes and Peter McClure MAT4C. Thermal Interface Materials: Thermal Mechanical Cycling
Peter McClure and Yujia Wang MAT9B. Self Assembly Paste Evaluation SAP Overall – 8X video
Michael Meilunas and Mahdi Farahikia REL11B. Modeling of BGA Applications under Tensile Load
Michael Gaynes, et al REL15C. Power Cycle Reliability Testing (PBGA, QFN)
Michael Meilunas APD8A. Solder Voiding Behavior in Vacuum Reflow Soldering Vacuum Reflow video
Thaer Alghoul and Pericles Kondos MAT6C. Sintered Silver Printing and Die Attach Study
Peter McClure and Michael Gaynes MAT4B. Thermal Interface Resistance: Surface Roughness Effects
Luke Wentlent APD11C. Selected Area Laser Rework