AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2017 MEETINGS

OCTOBER MEETING

  
AUTHOR PRESENTATION
  Agenda
Jim Wilcox Welcome/Introduction
Faramarz Hadian Electromigration Study of Lead-Free Solder Joints
Michael Gaynes, Holly Rubin MAT8D. Sulfur Resistor Corrosion: Conformal Coating Mitigation and Supplier Sensitivity
Divya Choudhary MAT4D. High Performance Die Level Thermal Interface Materials
Luke Wentlent APD11B. Laser Reflow Fundamentals
Christopher Ober Flexible Hybrid Electronic Materials
Peter McClure APD2B. Joining to Flexible Substrates with Asymmetric Heating
Luke Wentlent APD11. Laser Reflow Application Studies
Pericles Kondos REL9A. Mixed VIPPO Solder Defect Studies
Sa’d Hamasha Effect of Long Term Aging on the Fatigue Properties of SnAgCu Solder Joints
Peter McClure, Mahdi Farahikia REL16A. Die Size Effects on BGA Reliability and Mechanical Modeling Thereof
Michael Meilunas REL17A. System-in-Package Interconnect Reliability – SAC305
Michael Gaynes REL15B,C. Power Cycle Reliability Testing
Luke Wentlent, Thaer Alghoul, Mohammed Genanu Laser Reflowed Solder Joints / Mechanical Behavior / Quantitative Metallography
Peter McClure SnAgCu Elevated Temperature Aging Study
Michael Meilunas REL11B. HiP Assembly Challenges with Window PCB
Pericles Kondos MAT6C. Sintered Ag Die Attach Materials

JUNE MEETING

  
AUTHOR PRESENTATION
  Agenda
Jim Wilcox Welcome/Introduction
Michael Meilunas APD3B. Large Body BGA Characterization
Michael Gaynes REL15C. Combined Power Cycle & Environmental Thermal Cycle
Peter McClure REL7A. SnAgCu Thermal Aging Effects
Pericle Kondos MAT6C. Sintered Silver Die Attach Materials
Michael Gaynes MAT4B. Reliability of TIM2 Materials
Pericles Kondos REL9A. Mixed VIPPO Solder Defect Investigation
Mohammed Genanu REL12A. Thermal Cycle Test of 2.5D Copper Pillar Interconnects
Junghyun Cho Bismuth Based Transient Liquid Phase Bonding
Francis Mutuku MAT7E. Alternate Pb-free Solder Alloy Reliability
Luke Wentlent MAT6G. Solder Alloys for Automotive Applications
Peter McClure APD2B. Joining for Flexible Hybrid Electronics
Peter Borgesen Low Temperature Mixed Solder Assembly
Luke Wentlent APD11B. Laser Reflow Assembly — First Looks

 

 

MARCH MEETING

  
AUTHOR PRESENTATION
  Agenda
Jim Wilcox Welcome/Introduction
Mohammed Genanu REL12A. 2.5D Copper Pillar Interconnect Structures
Jim Wilcox APD11A. Laser Reflow Flip Chip Characterization
Michael Meilunas MAT2A. Four Point Bend Pad Cratering Study
Michael Meilunas REL3E. Laminate Material Effects in Mechanical Reliability Testing
Michael Meilunas REL10B. Solder Alloy Mechanical Reliability Testing
Sa’d Hamasha Reliability Impact of Long Term Thermal Aging on Lead Free Solders
Michael Gaynes MAT4B. TIM2 Performance Evaluations TIM2 Characterization Review
Michael Gaynes MAT4C. Ganged Heatsink TIM2 Reliability
Nancy Stoffel MAT9B. Flexible Hybrid Electronics: Materials and Assembly
Pericles Kondos MAT1B. Reworkable Component Underfills
Francis Mutuku MAT7E. Solder Alloy Reliability Studies
Pericles Kondos MAT6C. Sintered Silver Die Attach Materials
Michael Gaynes REL15B,C. Power Cycle Reliability Testing
Luke Wentlent REL2A. Deformation Behavior of SnAgCu Solder in Variable Amplitude Cycling
Michael Meilunas REL17B. SiP Structures – Alternate Solder Alloy Interconnects
Matt Kelly REL9A. Mixed VIPPO Array BGA Soldering Defects