by Kristi Schilloff | Oct 27, 2016 | Blog
October 28, 2016 – What’s your favorite POP (Coke, Pepsi, etc.)? Ours is actually a different type called Package-on-Package (PoP) – make sure to check out our cool PoP video below. This technology allows two or more electronic components to be stacked...
by Jeff Zopff | Oct 11, 2016 | Press Release
Unique architecture enables the first true volume solution for today’s consumer demands. October 11, 2016 – Universal Instruments’ Flexbond™ hot bar bonding platform was presented the Global SMT & Packaging Global Technology Award at the 2016 SMTA...