by Jeff Zopff | Mar 27, 2015 | Blog
April 14, 2015 – The abstract of a paper recently presented at SMTA Dallas by Universal Instruments’ Advanced Process Lab. The trend in packaging technologies that enables faster, more effective data transfer, and processing is a continuous goal for the...
by Jeff Zopff | Mar 16, 2015 | Press Release
Specialized nozzle design delivers near perfect yields for complex connector placement. March 16, 2015 – Universal Instruments and Schweitzer Engineering Laboratories have enjoyed a successful partnership for many years, with Universal being the first capital...
by Jeff Zopff | Mar 13, 2015 | Blog
March 12, 2015 – Have you ever looked at a computer motherboard, seen mostly surface mounted components and wondered why the designers chose to use leaded electrolytic capacitors in their design? Well it comes down to area and cost. While the functionality of...
by Jeff Zopff | Mar 9, 2015 | Blog
[section background_repeat=”repeat” background_position=”center top” background_attachment=”static” background_scroll=”none”] March 9, 2015 – Universal Instruments’ proprietary Topside Alignment Placement (TAP)...
by Jeff Zopff | Mar 3, 2015 | Blog
[section background_repeat=”repeat” background_position=”center top” background_attachment=”static” background_scroll=”none”] March 3, 2015 – Universal Instruments views customer training as one of the most...
