AREA CONSORTIUM MEETINGS
AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.
2015 MEETINGS
JUNE MEETING (WEBINAR PROJECT REPORTS) |
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| AUTHOR | PRESENTATION |
| Pericles Kondos |
Effect of Cu Roughness on Pad Cratering Strength On Demand |
| Pericles Kondos | High Tg PCB Laminates On Demand The first leg of the study of the effect of multiple “hot” reflows on many high-Tg laminates is nearly complete. For each laminate material, resin content and reflow history, 24 pads (from 2 different coupons) are being tested with Cold Bump Pull. This presentation focuses on a detailed discussion of a few cases rather than presenting all the available results. Of interest were not only any changes in strength due to the reflow exposure, but the magnitude of the pad strengths and how these values varied from laminate to laminate. The failure surfaces were also examined in detail. |
| Michael Meilunas | Paste Print Correlation to Reliability On Demand Through numerous printing trials, the naturally occurring variabiility in paste deposit volumes has been identified for various printing parameters. Instances of ‘outlier’ low volume deposits typically flagged as printing defects were carefully noted. Such paste print ‘defects’ have been designed into testable assemblies at high risk solder joint locations using a custom designed stencil. CSP, LGA, SMR and QFN components are being evaluated on TB2015. Assembled boards are in thermal cycle test. |
| Jeff Schake | Stencil Printing Considerations for 0.3mm Pitch CSP Assembly On Demand A detailed stencil printing optimization study is underway for the assembly of 0.3mm CSP components. Stencil printing factors such as aperture design (squares, circles, rotated squares), aperture size (from 140 mm to 200 mm) and printing process technology (standard squeegees, active squeegees) have been investigated. Detailed results and data analyses will be presented. |
| Michael Meilunas | Broadband Paste Printing On Demand Complex board designs are increasingly using fine pitch components such as WLCSP in close proximity to much more massive components such as large body BGAs. This study is being defined to evaluate the limits of conventional stencil printing to position fine pitch, high resolution prints adjacent to much coarser print deposits. PCB design considerations such as label ink and top surface traces are considered. The design limitations of stepped stencils, with and without nanocoating is also included. |
| Babak Arfaei | Progress with Pb-free Solder Alloys On Demand The AREA research portfolio includes multiple studies examining the performance of alternate lead free solder alloys under various conditions. Highlights from these various projects will be presented, including the effects of solder composition, joint volume and PCB surface finish on room temperature shear fatigue and accelerated thermal cycling performance. Additionally, the effects of processing parameters on joint microstructure and resulting mechanical behavior will be discussed. Updates on the status of current projects will be provided. |
| Harry Schoeller | Brittle to Ductile Transition in Bi-based Solder On Demand One drawback of bismuth-based solders is the brittle nature of bismuth leading to sudden unexpected failures. However at elevated temperature, where slip is more prevalent, bismuth can dynamically recrystallize into a fine grain structure which changes the primary deformation mechanism of the solder, making it much more ductile. This work reports on the brittle to ductile transition in bismuth solder and suggests the responsible mechanism change. |
| Harry Schoeller | Reliability of Pressureless Sintered-Ag Die Attach On Demand Sintered-Ag technology provides a Pb-free interconnection for high power/temperature applications. Previous consortium research has reported on the reliability of pressureless sintered-Ag joints with thin bondline thicknesses (<1mil). This update looks at the reliability of joints made with thicker bondline thicknesses (3-5mils) in high temperature storage and thermal shock. |
MARCH MEETING |
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| AUTHOR | PRESENTATION |
| Agenda | |
| Jim Wilcox | March AREA Introduction |
| Harry Schoeller | MAT6B : Reliability of Sintered Ag Die Attach On Demand |
| Michael Meilunas | REL6A : Paste Print Correlations to Component Reliability:Effect of Print ‘Outliers’ On Demand |
| Babak Arfaei | MAT7F : New Pb Free Alloys: Effect of Solder Composition on ATC Reliability On Demand |
| Thilo Sack | MAT7F : Lower Melt Solder for High Reliability Electronics Supplementary Files |
| Francis Mutuku | MAT7B : Microstructural Analysis and Isothermal Mechanical Behavior of Microalloyed Pb-free Solder Alloys On Demand |
| Pericles Kondos | MAT1A : Underfill Projects Update On Demand |
| Harry Schoeller | MAT6G : Solid State Interfacial Reactions of Pb-free Solders in High Temperature Environments On Demand |
| Babak Arfaei | REL12A : Reliability of Cu Pillar Interconnect for Next Generation 2.5D / 3D Packages On Demand |
| Eric Perfecto | REL12A : Cu Pillar Bumping on Silicon and Glass for Packaging Integration |
| SB Park | Speckle-Free Digital Image Correlation Method for in-situ Warpage Measurements |
| Harry Schoeller | APD3A : Large Body BGA Reliability On Demand |
| Michael Meilunas | MAT8B : Conformal Coating: Effects on Solder Joint Reliability On Demand |
| Quang Su | REL3A : Mechanical Response of Solder Joints under Vibration Loading |
| Nick Graziano | REL11A : Effect of TIM Compression Loads on BGA Reliability On Demand |
| Pericles Kondos | MAT2C : Pad Cratering Projects Update On Demand |
| Pericles Kondos | MAT2C : High Tg PCB Laminates: Effect of Multiple Reflows on Pad Strength On Demand |
| Michael Meilunas | APD9A : BGA Warpage: Evaluating JEDEC and JEITA Standards for Allowable Component Warpage On Demand |
| Shaui Shao | MAT7D : Effect of Solder Composition and PCB Surface Finish on Drop Test Performance On Demand |