by Jeff Zopff | Dec 11, 2014 | Blog
December 11, 2014 – You might ask, “What’s the difference between this nozzle and the older conical 0402 ceramic nozzle?” Simply put, we think this latest design is a far superior option. Here’s why… Life span: Instead of a thinner walled nozzle tip that you’ll...
by Jeff Zopff | Dec 3, 2014 | Blog
December 3, 2014 – Semiconductor packaging has traditionally followed dedicated equipment sets for given package formats or processes dictated by Bare Die or Flip Chip assembly. New Package Functionality, Performance, Miniaturization, Low cost materials are...
