by Jeff Zopff | Oct 30, 2014 | Blog
October 30, 2014 – October 22nd 2014, Universal Instruments participated in the Intelligent Manufacturing Industry Development Forum at the China Circum-Bohai Electronics Manufacturing and Intelligent Automation Exhibition (CEIA) in Tianjin, China. Glenn Farris,...
by Jeff Zopff | Oct 25, 2014 | Blog
October 25, 2014 – “There is no such thing as an ESD-safe machine without an ESD-safe nozzle.” Universal Instruments was a pioneer in ESD-safe (Electrostatic Discharge) machinery and tooling, so when an opportunity to validate this investment presented itself…...
by Jeff Zopff | Oct 20, 2014 | Press Release
Process expertise complements mature and versatile technologies to address diverse packaging and assembly requirements October 20, 2014 – Universal Instruments will be exhibiting on Table #8 at the 2014 MEPTEC Semiconductor Packaging Technology Symposium in...
by Jeff Zopff | Oct 16, 2014 | Blog
October 16, 2014 – When I meet people in the electronics industry and tell them I am the Marketing Manager for through-hole products at Universal Instruments, they almost always say “You still sell those machines? I thought through-hole technology is DEAD”. I...
by Jeff Zopff | Oct 14, 2014 | Blog
October 14, 2014 – Pad cratering occurs when there is a break within the resin between the copper foil and outermost layer of fiberglass of a PCB (cohesive), or at the resin-to-glass interface (adhesive). The pad is separated from the PCB, leaving a crater on...
