by Jeff Zopff | Aug 19, 2014 | Events
Universal Holds Technology Seminars at NEPCON Shenzhen August 26–27, 2014 Rose Hall #2, 5th Floor
by Jeff Zopff | Aug 19, 2014 | APL News, Press Release
Seminars to focus on key challenges and solutions for the Chinese electronics manufacturing market August 19, 2014 – Universal Instruments invites electronics manufacturers to join the company for an informative technology seminar held on August 26–27 in Rose...
by Jeff Zopff | Aug 19, 2014 | Blog
August 18, 2014 – Universal Instruments is going to hold a China market-focused seminar at NEPCON Shenzhen on August 26 & 27, in Rose Hall #2, 5th floor, Shenzhen Convention Center, and the Advanced Process Laboratory (APL) will present the precise and...
by Jeff Zopff | Aug 17, 2014 | Blog
August 17, 2014 – Universal Instruments’ Dr. Babak Arfaei is going to present “Effect of Sn Grain Morphology on Reliability of Lead Free Solder Joints in Thermal Cycling Tests” on August 25 at iNEMI Workshop on Board Assembly & Test Technology in Shenzhen,...
by Jeff Zopff | Aug 4, 2014 | Blog
August 1, 2014 – It has been more than 5 years when the first generation of Package-on-Package came into form. The primary objective is to combine the memory and the application specific integrated circuit (ASIC) to use much lesser real property this shrinking...
