AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2014 MEETINGS

OCTOBER MEETING

 
AUTHOR PRESENTATION
  Wednesday Morning
  Agenda
Jim Wilcox Introduction
Pericles Kondos MAT1A – Underfill Studies: a) Reliability Update and Failure Analysis  On Demand  b) Underfilm instead of Underfill  On Demand
Harry Schoeller MAT6B – Characterization of Ag-sintered Past as Pb-free Die Attach Material as Pb-free Die Attach Material On Demand
Francis Mutuku MAT7B – Isothermal Shear Fatigue Behavior of Microalloyed Lead-Free Solder Alloys On Demand
Babak Arfaei MAT7D –Drop Shock Reliability of Various Lead-Free Alloys On Demand
Linda Woody Pb-free Manhattan Project – Rebaseline –
  Wednesday Afternoon
Michael Meilunas MAT8A – Impact of Conformal Coatings on Thermal Cycle Reliability of SMT Components On Demand
Babak Arfaei MAT7A – Effect of PCB Surface Finish and Solder Volume on Thermal Fatigue Performance of Lead-Free and SnPb Solder Joints  On Demand
Harry Schoeller MAT6C – Thermo-mechanical Reliability of High Temperature Interconnects
Quang Su and Aaron Stewart REL3A – Finite Element Analysis and Experimental Characterization for Vibration Reliability of LGA vs. BGA Packages
Dave Pinsky,Tony Rafanelli, Dave Hillman, Sebastian Fonseka, Steve Davidson PERM Project Updates
  Thursday Afternoon
Peter Borgesen REL2A – Model for Fatigue Life of Lead-free Solder On Demand
Sa’d Hamasha REL2A – Effects of Varying Amplitude on Solder Joint Fatigue in Isothermal Cycling On Demand
Nicholas Graziano REL11A – Effect of TIM Compression Loads on BGA Reliability On Demand
Harry Schoeller MAT6B – Isothermal Fatigue of High Melting Point Alloys
Mohammad Quran MAT2B – Effect of Pad Locations relative to Glass Weave on Cratering  On Demand
Harry Schoeller MAT6A – Effect of Sn Component Surface Finish on 92.5PbSn2.5Ag On Demand
Jim Wilcox MAT6B –2015 Research Plan Highlights

JUNE MEETING

 
AUTHOR PRESENTATION
  Agenda
Jim Wilcox June AREA Introduction
  Materials Track
Pericles Kondos MAT1A Underfill Part IOn Demand
Mohammad Quaran MAT1A Underfills and Adhesives-Part IIOn Demand
Harry Schoeller MAT4A – Characterization of Gap Pads with Fixed Bondline and Phase Change MaterialsOn Demand
Nicholas Graziano REL11A Effect of Compression Loads on BGA ReliabilityOn Demand
Martin Anselm MAT8A Conformal Coating UpdateOn Demand
Pericles Kondos MAT2A Pad Cratering in TB2014-ELMOn Demand
Harry Schoeller MAT6C – Characterization of High Temperature Solder AlloysOn Demand
Francis Mutuku MAT7B Effect of Microstructure on Isothermal Mechanical Properties of Various Solder AlloysOn Demand
Babak Arfaei MAT7C Effect of Isothermal Aging on Reliability of LF ProductOn Demand
Richard Coyl (Alcatel-Lucent) ref: p765 Coyle et al. 64th ECTC The Effect of Microalloying on Thermal Fatigue Reliability and Microstructure of SAC Solders Ni Microalloying
  Advanced Process Development (APD) Track
Janice Meraglia (VP for Military and Government Programs at Applied DNA Sciences) SigNature® DNA – DNA-based Anti-counterfeiting Technology Solution
Harry Schoeller MAT6B Characterization of High Temperature Solders used for Passive DevicesOn Demand
Chris Anglin MAT5A Paste Print Project Status Update
  Reliability Track
Peter Borgesen REL2A Correlation Between Accumulated Work and Fatigue Life of Lead-free Solder Joints
Michael Meilunas REL6A Print Correlations to ReliabilityOn Demand
Aaron Stewart REL3A LGA vs. BGA Vibration Performance
Michael Meilunas REL10A Drop test JESD22-B111 Redesign Evaluation Characterization of Proposed JEDEC Drop Test VehicleOn Demand
Babak Arfaei MAT7A Effect of Nanodopants on Reliability of LF Solders in Drop TestingOn Demand

FEBRUARY MEETING

 
AUTHOR PRESENTATION
  Agenda
Martin Anselm February AREA IntroductionOn Demand
  Reliability Track
Harry Schoeller MAT4A: Component Level TIM Characterization (Final Report)On Demand
Sa’D Hamasha REL2A: Correlation Between Accumulated Work and Fatigue Life of Lead-free Solder JointsOn Demand
Sa’d Hamash and Luke Wentlent REL2A: Effects of Sn-grain Orientation on the Fatigue Life of Lead-free Solder JointsOn Demand
Michael Meilunas REL10A: Drop Test JESD22-B111 Redesign Evaluation
Pericles Kondos REL4A: Creep CorrosionOn Demand
Michael Meilunas REL9A: HDI Design Review
Prof. Quang Su (Binghamton University) REL3A: Circuit Board Strain Laser Vibrometer
Prof. Quang Su (Binghamton University) REL3B: Vibration Reliability Plans
Prof. Quang Su (Binghamton University) Prof. Su’s Combined Presentations On Demand
Prof. SB Park

Design and ReliabilityOn Demand
1 Inch Metal Ball Drop on Glass – Video
300mm Wafer Warpage during Reflow – Video
Cell Phone Case with PCB – Video
Board Strain – Video
Component Warpage at Elevated Temperature – Video

Prof. James Pitarresi (Binghamton University) Modeling and Characterization for Shock and VibrationOn Demand
  Advanced Process Development (APD) Track
Michael Meilunas APD3B: WLCSP Reliability Analysis Effect of RDL Design on Thermal Cycle Results
Gaurang Joshi APD8A: BGA vs. LGA Drop Test ComparisonOn Demand
Michael Meilunas ADP3A: TB2013 ATC Reliabiliy
JD Shin of Koh Young SPI Optimization – Koh YoungOn Demand
Charles Woychik of Invensas BVA Review – InvensasOn Demand
  Materials Track
Martin Anselm MAT8A: Conformal Coating Effect on ATC ReliabilityOn Demand
Babak Arfaei MAT3A: TB2013 Surface Finish Failure AnalysisOn Demand
Babak Arfaei MAT7A: New Alloy ProjectOn Demand
Michael Meilunas MAT7A: New Lead Free Alloy Evaluation and MicrostructureOn Demand
Francis Mutuku MAT7A Effect of Nanodopants on Reliability of LF Solders in Drop TestingOn Demand
Pericles Kondos MAT1A: Underfill UpdateOn Demand
Harry Schoeller MAT6B: Fatigue Behavior of New Die Attach Alloys
Harry Schoeller MAT6A: Update Effect of Sn on HMP SolderOn Demand