AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2013 MEETINGS

SEPTEMBER MEETING

  
AUTHOR PRESENTATION
  Business Cards
Martin Anselm Introduction
David McCann Vice President, Packaging and R&D, GLOBALFOUNDRIES – Keynote Trends in the Development and Implementation of Interconnect and Packaging Technologies
  Materials Track
Harry Schoeller MAT4A: TIM, The Effect of Thermal Storage on Gap-Pad Performance (On Demand)
Pericles Kondos MAT1A: Underfill Studies – Process Development and Characterization (On Demand)
Yuan Zeng MAT10A: Laminate and Glass Studies in Pad Cratering (On Demand)
Babak Arfaei MAT7A: New Alloy Reliability Testing – Effect of Size and Composition (On Demand)
Francis Mutuku MAT7A: Effect of Solder Composition and Trace Elements on Mechanical Shear Fatigue (On Demand)
  Reliability Track
Sa’D Hamasha REL2A: Accounting for the Evolution of SnPb and SnAgCu Properties and the Resulting Breakdown of Linear Damage Accumulation Rules in Cycling with Varying Amplitudes (On Demand)
Prof. Peter Borgesen (Binghamton University) REL2A: Current LF Models and Progress Update on Modification (On Demand)
Pericles Kondos REL4A: Creep Corrosion – Effects of Test Methods (On Demand)
Gaurang Joshi REL1A: PCB Prestress & Pad Cratering a Modified Test Method (On Demand)
Prof. Quang Su (Binghamton University) REL3A: Vibration Reliability Testing and Analysis
Prof. James Pitarresi (Binghamton University) REL3A: Modeling and Characterization of Shock and Vibration (On Demand)
Babak Arfaei MAT2B: Effect of Isothermal Preaging on Accelerated Thermal Cycling Tests (On Demand)
  Advanced Process Development Track
Yuan Zeng APD3A: LGA vs BGA Pad Cratering (On Demand)
Michael Meilunas APD2A: 0.3mm Pitch Build Report and Drop Testing and ATC Results (On Demand)
Michael Meilunas APD3A: TB2013 Reliability Update (On Demand)
Babak Arfaei APD3A: TB2013 Reliability Failure Mode Evaluation (On Demand)
Martin Anselm MAT8A: Conformal Coating Early Reliability Data and Characterization (On Demand)
Harry Schoeller MAT6A: High Melting Point (HMP) Electronics – Test Board Design and Planning (On Demand)

JUNE MEETING

  
AUTHOR PRESENTATION
  Business Cards
Jim Wilcox Agenda
Martin Anselm Introduction – On Demand
  Materials Track
Harry Schoeller MAT4A – Component Level TIM Comparison – On Demand
Pericles Kondos MAT1A – Underfill Research Plans – On Demand
Yuan Zeng MAT10A – Pad Cratering Glass Orientation Effect – On Demand
Pericles Kondos MAT3A – TB2013 Pad Finish Evaluation – On Demand
Harry Schoeller MAT6B – New Pb-free Die Attach Alloys – On Demand
Babak Arfaei MAT2B & MAT7A – Low Ag LF Microstructure and Reliability – On Demand
Francis Mutuku MAT7A – Effect of Microstructure on Shear Fatigue – On Demand
NSI GUEST SPEAKER, Wes Wren X-ray Tomography
  Advanced Process Development (APD) Track
Michael Meilunas ADP3A – TB2013 Build Report and Printing Optimization – On Demand
Harry Schoeller ADP4A – Vapor Phase Rework of High IO Components – On Demand
Jeff Schake of DEK MAT5A – 0.3mm Pitch Update – On Demand
OKi GUEST SPEAKER, Paul Wood Challenges in Rework for Smart Phones and Tablets
  Reliability Track
Martin Anselm MAT8A – Impact of Conformal Coating on Thermal Cycling Reliability of SMT Components – On Demand
Prof. Jame Pitarresi of BU REL1A – Modeling of Spherical Bend Test Method
Michael Meilunas REL1A – Effect of Prestressing on PCB Pad Cratering – On Demand
Pericles Kondos REL4A – Creep Corrosion Update – TB2013 Surface Finish Testing – On Demand
Sa’D Hamasha REL2A – Variable Loading of Low Ag Alloys – On Demand 
Sam Sirazi REL2A – Thermal Cycling, The Mechanisms Behind Surprising Trends – On Demand
Prof. Quang Su of BU REL3A – Vibration Test Update and FA
Prof. Jame Pitarresi of BU REL3A – Modeling and Characterization for Shock and Vibration

FEBRUARY MEETING

  
AUTHOR PRESENTATION
  Agenda
  Attendance
Martin Anselm Introduction – On Demand
Michael Meilunas Pad Cratering – On Demand
Chris Anglin Paste Measurement – On Demand
Jeff Schake (DEK) 0.3mm Pitch Print Development – On Demand
Pericles Kondos Cycling Effect on Laminate Strength – On Demand
Harry Schoeller Effect of Sn on HMP – On Demand
Harry Schoeller Pb-free Die Attach Update – On Demand
Pericles Kondos Angled HBP Methodology – On Demand
Yuan Zeng (BU Student Research Associate) PCB Material Testing Update – On Demand
Prof. Quang Su (BU Mechanical Engineering) Resonance Tracking Vibration Testing
Michael Meilunas Strain Analysis – On Demand
Prof. James Pitarresi (BU Mechanical Engineering) Modeling and Characterization for Shock and Vibration – On Demand
  Modeling and Characterization for Shock and Vibration – On Demand
Babak Arfaei Lead-Free Failure Mechanisms in ATC Testing – On Demand
Shantanu Joshi (BU Student Research Associate) Slow and High Speed Shear Testing of New Alloys – On Demand
Prof. SB Park (BU Mechanical Engineering) Digital Image Correlation
Harry Schoeller Component Level TIM Comparison – On Demand
Michael Meilunas Fine Pitch Reliability Final Update
Michael Meilunas Effects of ATC Parameters – On Demand
Peter Borgesen (BU SSIE Department) Lead Free Solder Joints in Thermal Cycling – On Demand
Peter Borgesen (BU SSIE Department) Comparing Lead Free Solder Alloys in Terms of Reliability – On Demand
Denis Barbini Wave Soldering Hole Fill Planning
Pericles Kondos Creep Corrosion Update – ENEPIG – On Demand