AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2010 MEETINGS

MARCH MEETING

 
AUTHOR PRESENTATION
  Pad Cratering: Our Current Understanding and Test Plans
  Pad Cratering: Latent Laminate Damage
  ATC Reliability Testing Update
  Effects of Solder Joint Dimensions on Life in Thermal Cycling
  Solder Microstructure Evolution and Consequences
  Mechanical Fatigue Study of Lead Free Alloys: Correlations with Strain Energy Density
  On the Microstructure of Pb-free TSOP, QFN, and LGA Solder Joints: Consequences for Thermal Cycling Performance and Acceleration Factors
  Effects of Pb-Free Solder Joint Size on Microstructure, Mechanical Properties & Aging Kinetics
  On the Evolution of the Properties and Microstructure of Backward Compatible Solder Joints during Cycling and Aging
  Lead-Free Solder Reliability in Complex Loading Environments
  Assessment of Life of Lead Free Solder joints Under Realistic Service Conditions: Practical Consequences and Recommendations
  ENEPIG Updates
  Printing Considerations for Fine Pitch, Including 01005s and WLCSPs
  Thermal Optimization of Filled-Polymeric TIM Bondlines
  Creep Corrosion
  Conformal Coatings

JUNE MEETING

 
AUTHOR PRESENTATION
  Update: Effects of Print Paste Volume on Drop Test Performance for 0.4mm Pitch CSPs
  Reliability of Thermal Interface Tapes
  Compaction Driven Performance Enhancement of Filled-Polymeric Thermal Bondlines
  Thermal Interface Assembly Cook-Book
  Cratering: Correlations Between Pad and Assembly Level Strength
  Effects of Variable Loading on Pad Cratering
  Intermetallic Failures on Electrolytic Ni/Au
  Overview: Lead Free Solder Microstructure And Reliability
  Effects of Lead Free Solder Joint Size on Aging Kinetics
  Precipitate Coarsening and Recrystallization in Thermal Cycling of Lead Free BGAs
  Cycling Induced Recrystallization of Lead Free BGA Joints in Cycling: Effects of Ag Content, Pre- and Post-Annealing
  Solderability and Properties of Low-Ag Solder Alloys
  Different Microstructure Evolution in Thermal Cycling of Lead Free TSOPs, QFNs, etc.
  Combined Effects of Vibration and Thermal Cycling of Lead Free Solder Joints
  Lead Free Solder Fatigue in Cyclic Bending: Effects of Variable Loading
  Reliability and Microstructure of Backward Compatible Solder Joints
  Thermal Cycling Update: TSOP, QFN, LGA, Passives, are Different From BGAs!
  Reliability of Reballed Components
  Lead Free Solder Joints on ENEPIG Pads

OCTOBER MEETING

 
AUTHOR PRESENTATION
  Thermal Interface Bondline Characterization
  Pad Cratering Update
  Assembly with Low-Ag Solders
  Solar Power Packaging
  Thermal Cycling Update & New Test Vehicle Designs
  Effects of Solder Volume on Thermal Cycling Life
  Effects of Solder Joint Dimensions on Aging Kinetics
  Recrystallization
  Effects of varying Load Amplitudes on Solder Joint Life
  Backward Compatible Assembly: What Really Happens?
  Solder Microstructure Evolution: Practical Consequences
  Creep Corrosion of PCB Assemblies
  Flexible Electronics
  0.4mm Pitch PCB Design
  Drop Testing of 0.4mm CSPs: Correlation to Print Volume
  Tin Whiskers