AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2009 MEETINGS

MARCH MEETING

 
AUTHOR PRESENTATION
  Fatigue of low-Ag solder joints
  Thermal cycling of lead free solders
  Empirical modeling of thermal cycling test results
  Crack initiation and growth in lead free solder joints during thermal cycling and cyclic bending, including the potential for much faster life prediction
  Lead free solder microstructure
  Quantitative understanding of recrystallization and consequences for lead free life assessment Materials
  Results and models for the effects of varying loads on lead free fatigue (Miner’s rule)
  Tutorial on the mechanisms and complications of solder pad cratering
  A serious risk of pad cratering is universally overlooked
  Cratering and solder failure for different SAC alloys in drop and cyclic impact (pendulum) testing
  Printing of solder paste for 0.4mm pitch area array assembly manufacturing
  Intermetallic bonds to ENEPIG and Ni/Au pad finishes
  Performance of underfills and edge bonds in drop testing
  Voiding in Cu3Sn
  Characterization of Thermal Interfaces
  Precommercial TIM Process Development and Reliability Evaluation
  Thermal Tape Characterization

JUNE MEETING

 
AUTHOR PRESENTATION
  Reliability Investigation of SN100C: Phase II
  Lead Free Thermal Cycling Progress
  Failure Analysis
  Pad Cratering Test Methods
  Recrystallization of SAC Solder Joints in Thermal Cycling
  Accelerated Aging of Lead-Free SolderJoints
  Effects of Different Load Combinations on Pb-Free Solder JointsSn
  Reflowing Low-Ag(+X) Joints
  Lead Free Solder Joint Reliability
  The Manhattan Project
  Sporadic Failure of Solder Joints on Ni/Au Pads
  Thermal Bondline Assembly
  Rapid Ranking and Screening Procedures for Underfills and Corner/Edge Bonds
   

OCTOBER MEETING

 
AUTHOR PRESENTATION
  Thermal Cycling Update
  Neural Network Analysis of Thermal Cycling Data
  Pad Cratering
  Pad Crater Testing
  New Thermal Interface Materials
  Reliability of Thermal Interface Materials
  Spalling in Lead Free Solder Joints
  Microstructure of Low-Ag Alloys
  Soldering with Low-Ag Alloys
  Damage Accumulation Under Variable Loads
  Damage Accumulation and Microstructure
  Microstructure Evolution in SnAgCu Solder Joints
  Edge and Corner Bonding
  Testing for IMC Issues on Ni Pads
  Flux Dipping
  Reballing
  ENEPIG
  Consortium Reports