AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2008 MEETINGS

JUNE MEETING

 
AUTHOR PRESENTATION
  Electronics Packaging for Military and Aerospace
  Brittle Failure and Spalling on Ni/Au
  How to Prevent Voiding
  Sn and Other Metal Whiskers
  Thermal Cycling of Lead-Free Solders
  ‘Bump’ and RecrystallizationSn
  Thermal Cycling Test ProtocolSn
  Effects of Dwell in Isothermal Fatigue Testing
  Comparison of Pad and Board Level Testing
  Development of Micro-Impact Fatigue Testing
  Thermal Interface Materials
  Interconnect Stress Testing Results
  Nelco Laminate Roadmap
  Pad Cratering in Area Array Repair
  The Role of Glass Fibers in Pad Cratering
  Fine Pitch Flip Chip Assembly/Au

OCTOBER MEETING

 
AUTHOR PRESENTATION
  Update on Voiding in Cu3
  A Case Study of Sproadic Brittle Failure on Ni/Au Surface Finish
  Brittle Failures on Ni/Au Finishes: Part II
  Package-on-Package Assembly and Reliability Investigation
  Vibration Test Results
  Lead Free Thermal Cycling Progress<
  “High Density” Reliability Test
  Pb-Free Laminate Testing and Recommendations
  Pad Cratering UpdateSn: An Update
  CAF Response to Mechanical Loading
  PCB Damage in Area Array Repair: Week 41 Update
  Controlling the Rework Profile
  Thermal Interface Bondline Assembly
  Quantitative Acceleration of Long-Term Agin
  Microstructure Evolution in Pb-Free Solder Alloys During Isothermal Aging
  Microstructure Evolution in Pb-Free Solder Alloys During Thermal Cycling
  Solar Panel Technology
  Paste/Underfill Compatibility Update
  Underfill Flow Studies
  Mechanical Test of Edge and Corner Bond Assemblies
  Underfill and Solder Joint Loading in Thermal Cyclin

MARCH MEETING

 
AUTHOR PRESENTATION
  Drop Testing Update
  Thermal Cycling Update
  Thermal Cycling Induced Microstructure Evolution in Lead Free Solder
  Cycling Induced Recrystallization of Lead Free Solder and Why You Should Care
  Acceleration of Long Term Aging Effects in Lead Free Solder
  The Complete Breakdown of Miner’s Rule in Load Controlled Cycling of No-Pb Solder
  On the Breakdown of Miner’s Rule for Lead Free Solder
  Vibration Testing of Multiple Alloys & Pad Finishes
  Thermal Interface Materials
  Electrolytic Cu Plating Recommendations
  The Nature of Pad Cratering
  PCB Cook Book Update & Halogen Free PCB Plans
  Digital Human Modeling Technology: Overview, Opportunities, and Applications
  Component Underfill Cook Book
  Adhesion/Cohesion Testing of Underfills and Corner/Edge Bonding Materials
  Drop Testing of Corner/Edge Bonded Assemblies
  Lead Free Rework
  Area Array Repair Cook Book