AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2007 MEETINGS

JUNE MEETING

 
AUTHOR PRESENTATION
  QFN Process Development and Reliability Project
  On the Behavior of Bubbles in Liquids
  Voiding in Paste-Only Solder Deposits
  Component Underfills
  Package-on-Package
  Voiding in Cu3Sn
  Copper Electroplating and Voiding in Cu3Sn
  Effects of Microstructure on Lead Free Solder Joint Reliability
  Lead Free Solder Joint Fatigue Study
  Pb-Free Thermal Cycle Testing Overview
  Challenges in Thermal Cycling of Lead Free Solders
  FCBGA Thermal Cycling Project
  Lead Free HASL Project Update
  2008 Plans?
  Pad Cratering Update
  Missing Ball and Other Brittle Failures on Ni/Au
  Effects of Au on Brittle Failures in Assemblies on Electrolytic Ni/Au
  Investigations of Brittle Failure of IMCs on ENIG
  Underfill for Lead Free Flip Chips
  Reballing Lead Free Components with SnPb

OCTOBER MEETING

 
AUTHOR PRESENTATION
  Advanced Process Laboratory: Process Research and Support
  Lead Free PCB Projects Update
  Lead Free HASL
  Pad Cratering: Correlations Between Joint Level and Board Level Testing
  High Speed Bond Testing
  CSP Underfill and Edge/Corner Bonding Studies
  Intermetallic Formation in the Sn-Cu-Ni System
  Brittle Failures of Joints on Electrolytic Ni/Au
  Copper Electroplating and Voiding in Cu3Sn: An Update
  Preconditioning of Lead Free Solder Joints
  Solder Joint Strain Analysis
  Thermal Cycling of Lead-Free Solder
  Thermal Bondline Assembly
  TIM Studies
  Lead Free FC Thermal Cycling Parameters
  Effects of Solder Microstructure on Fatigue
  Reliability Test Plans & Schedule
  Solder Paste Selection for QFN Assembly
  Component Characterization
  Redressing Repair
  A Rework Process for LGA Components

MARCH MEETING

 
AUTHOR PRESENTATION
  Advanced Process Laboratory/AREA Consortium
  Pb Free Solder Alloy Reliability Update
  Mixed Solder Alloy Reliability Update
  Voiding in Cu3Sn: Why it is Sporadic?
  Solder Joint Strain Analysis
  Fine Pitch Flip Chip and TSV Based Die Stacking
  Pad Cratering:Relating Pad-Level Testing to Board Level Reliability
  Intermetallic Bonds to Ni/Au Pads
  CSP Underfill and Edge/Corner Bonding Studies
  Lead Free PCB Projects Update
  Cycling Results for Pb-Free Flip Chips with 8 Underfills
  Thermal Cycling Test Protocols for Lead-Free Solder
  APLWeb Online Registration and Tools
  Relationships between Drop Reliability and Energy
  Ongoing and Future Repair Projects
  Thermal Cycling Test Protocols for Lead-Free Solder
  Correlations Between Microstructure and Fatigue Life in Pb Free Solder
  Effect of Reflow Profile on Sn Undercooling and Microstructure Evolution in Sn-3.5Ag and Sn-3.9Ag-0.6Cu Lead Free Alloys
  Thermal Interface Bondline Assembly
  Void nucleation, Growth and Shrinkage in SAC405/Electrodeposited Cu Foil Solder Joints
  2007 Master Report List (Excel file)