AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2005 MEETINGS

JUNE MEETING

 
AUTHOR PRESENTATION
  Inhibiting Voiding in SAC/Cu IMC Structures
  Effects of BGA Underfilling on Drop Test Performance
  Moisture/Reflow Testing
  SnCu Flip Chips
  Interfacial Reactions of Sn-Ag-Cu Solders Modified by Zn Addition
  Rework Cookbook Update
  Wetting, Spreading & Soldering
  Effects of No-Pb Rework on 2nd Level Reliability
  “Forward Compatible” Solder Joint Reliability
  Minimizing Reflow Temperature for Reliable Lead-Free Assembly
  Effects of Pre-Assembly Parameters on No-Pb Microstructure and Reliability
  Voiding in SAC/Cu IMC Structures
  Is Zinc the Solution?
  Mechanical Vibration and Shock: Modeling and Measurement
  Lead-Free Reflow: PCB Laminate/Prepreg Bonding Evaluation

OCTOBER MEETING

 
AUTHOR PRESENTATION
  Mechanics of Drop Testing
  Loctite Hysol FF2300 No-Flow Underfill
  Soldering Gold Bump Flip Chips Wrap-Up
  BGA Underfill Evaluation: Medical Device and Standard Product Mechanical Testing I
  Cu Plating Study
  Chip Cap Cracking in Lead-Free Assemblies
  Improving Thermal Interface Bondlines
  Voiding in Electrodeposited Copper Foils
  How to Eliminate Voiding: Microstructure and Stress
  Undercooling of SAC Solder Joints
  Mixed Assembly Reliability Testing Update
  Smart Protocols for Growth of Epitaxial Metal Films
  Copper Screening Test Update
  How to Eliminate Voiding: SACZn Solder
  Our Current Understanding of Voiding
  Voiding and Cu Plating Parameters, Including Chemistry
  Voids in Cu3Sn: An Update
  Assessing Lead-Free Reliability
  Understanding Lead-Free Reliability
  Assembly-Induced Defects in Thermal Interfaces
  Variability in Lead Free Solder Ball Pull Strength: Effect of Crystal Orientation
  The Effect of Voiding on Pull Test Results
  Lead-Free Reflow: PCB Dielectric to Pad Adhesion Assessment
  Lead-Free PCB Damage: Material Selection
  BGA Underfill Evaluation: Medical Device and Standard Product Mechanical Testing II

MARCH MEETING

 
AUTHOR PRESENTATION
  Drop Testing of Lead-Free and Mixed Solder Assemblies
  Solder Bump and Pad Pull Testing
  DAGE Solder Ball Testing Update
  Component Underfilling and Edge/Corner Bonding
  Flip Chip Program
  HP SAC/Ni Discussion
  Rework Cookbook Update: 2005
  Process Induced Defects in Thermal Interface Materials
  Voiding in Electrodeposited Copper Foils
  IMC Problems in SAC/Ni Soldering
  Mixed Alloy Testing Update: 2005
  QFN/MLF Process Manual Overview
  Pb-Free Testing Update: 2005
  Microstructure of Mixed Solder Alloys
  Voids in Cu3Sn: Review and Update
  Solder Pad Finish Issues
  Enhanced Thermal Bondlines: Nanocomposite Thermal Interface Materials
  Voiding and Intermetallic Strength of SAC Solder on Cu Pads
  Solder Bump Pull Test and Shear Fatigue Evaluation of Mixed Solder Mechanical Properties
  Lead Free Assembly and PCB Damage [Parts I & II]