AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2004 MEETINGS

JUNE MEETING

 
AUTHOR PRESENTATION
  BGA Underfilling
  BGA Underfill Analysis
  ENIG Pad Finish Studies
  Effect of Component Weight on Double-Sided No-Pb Assembly
  Analysis of Early Failures Among Fine Pitch CSP Assemblies
  Effects of Reflow Ambient and Paste Printing on Reliability of No-Pb Fine Pitch Assemblies
  Effect of PCB Immersion Silver Thickness on 2nd Level Reliability
  Introduction to the Sekisui Micropearl SOL
  Mechanical cycling and Failure Analysis of Mixed Solder CSP Assemblies (I)
  Mechanical cycling and Failure Analysis of Mixed Solder CSP Assemblies (II)
  MLF Assembly and Reliability
  Solder Joint Reliability as a Function of Ag % (& Cu %)
  Rework Cookbook Development
  Effect of Temperature Ramp Rate on 2nd Level Reliability
  Gold Bumped Flip Chip Assembly
  Gold Bumped Flip Chip Assembly (Part II)
  Flip Chip Reliability After Aging
  No-flow Flip Chip Assembly on Flex – Substrate Issues
  Flip Chip Reliability Test Results
  Framing the Process Window: Optimizing Thermal Interface Assembly
  Codification Software: Placement Yield Module

OCTOBER MEETING

 
AUTHOR PRESENTATION
  BGA Underfilling
  Pb-free Chip Cap Failure
  Influence of Composition and Cooling Rate on the Microstructure of Sn-Ag-Cu Solder Alloys
  Kirkendall Voiding in Cu Pads and Other Pad Issues
  Effects of Reflow Parameters and “Memory” on Pb-Free Solder Joint Microstructure
  Concerns with Mixing Sn/Pb and Pb-Free Solders
  Summary: Fragility of SAC Joints
  PCB Damage in Pb-Free Reflow and Rework
  PCB Cu Plating Anomalies and Thermal Failure Mechanisms
  Assembly with No-Clean Polymer Flux (NPF)
  Profiling Issues in Lead-Free Rework
  Update: Rework Cook-Book
  Effect of Thermal Cycle Dwell Time on 2nd Level Reliability
  Flip Chip Reliability after Aging
  Au-bumped Flip Chip
  Board Design Issues for Flip Chip
  Gold Bump FC
  Moisture/Reflow Testing
  Soldering Evaluation of New Flip Chip Fluxes
  RFID Project
  Assembly with Thermal Interface Materials
  CALCEPWA Reliability Prediction Software

MARCH MEETING

 
AUTHOR PRESENTATION
  Alternate QFP Surface Finishes
  Ball and Polymer Collar Attach to Fine Pitch CSP With Kester 9690 No-clean Polymer Flux
  BGA Underfilling
  Copper Structures and Pad Evaluation
  Cu Consumption Study
  Effects of Thermal Cycle Dwell Time on 2nd Level Reliability
  Influence of Composition and Cooling Rate on the Microstructure of SnAgCu Solder Alloys
  Lead Free Assembly — Board Damage Assessment
  Lead-Free Reflow: Board Damage and Thermal Analysis Correlations
  Lead-free Rework Guide
  Lead-free Rework Issues
  Mixed Assembly Reliability
  Mixed SnAgCu/SnPb Solder Joints
  SAC Fragility – Intermetallic Growth
  SAC Fragility – Introduction
  SAC Fragility – Speculation
  Sekisui Micropearl SOL (Resin Bump)
  SIMS Analysis, ‘Good’ & ‘Bad’ Cu
  Surface Mount Capacitor Reliability After Lead-free Assembly
  The Behavior of Voids in Cu-Sn
  Where Do Voids Form and Grow?
  Flip Chip Reliability Experiments
  Gold Bump Flip Chip
  Reflow Encapsulant Reliability
  Thin Flip Chip BGA Project
  Improving Thermal Interface Bondlines