AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2003 MEETINGS

JUNE MEETING

 
AUTHOR PRESENTATION
  Microstructure of Mixed Tin-Lead / No-Lead Solder Joints
  “Mixed” CSP and BGA Reliability
  0.4 mm Pitch CSP Printing
  0.4 mm Pitch CSP Assembly & Reliability
  Solder Joint Bridging in 0.4 mm Pitch CSP Assembly
  Soldering to Electroless Ni/Immersion Au – The “Black Pad” Failure Mechanism
  2nd Level Reliability Update
  Underfilling by Stencil Printing
  Room Temperature Underfilling
  The Most Promising Underfills
  The Most Promising Underfills
  High Temperature JEDEC Level 3 Moisture/Reflow Sensitivity Testing
  Progress on Assembly of Au-Bumped Flip Chips to Solder Bumped Substrates
  Effects of Electromigration in No-Pb Flip Chip Assemblies
  Reliability Effects of Thermal Excursions and Thermal Aging on SAC-Bumped Flip Chips
  No-Lead Flip Chip Joint Microstructure Effects of Thermal History and Process Variables
  Pb-Free Reflow Encapsulants
  Lid Attach
  A New Generation of Thermal Interface Materials; An Analytical and Experimental Study
  Application of Thermal Interface Materials by Stencil Printing
  Printing & Dispensing of Thermal Interface Material – An Initial Comparison
  Evolution of Voids in Thermal Interface Material During Cure
  Characterization of Thermal Interface Materials

OCTOBER MEETING

 
AUTHOR PRESENTATION
  Reliability of mixed SnPb/no-Pb solder joints
  Microstructure evolution in mixed SnPb/no-Pb solder joints
  Ag concentrations
  Immersion Ag pad finishes — variability and assembly
  Reliability of area array assemblies on immersion Ag pad finishes
  CSP underfilling by stencil printing
  2nd Level reliability update
  Squeegee based and pressure enhanced solder paste printing
  0.4mm pitch CSP assembly
  0.4mm pitch CSP rework and reliability
  Materials for manufacturing in China – Preliminary PCB studies
  Assembly of Au stud bumped flip chip
  No-Pb flip chip assembly & reliability
  Effects of cycling and aging on no-Pb flip chip solder joint microstructure
  Effects of electromigration and aging on flip chip assemblies
  Reliability of SnPb based flip chip assemblies with no-flow underfills
  No-Pb flip chip assembly with, and reliability of,no-flow underfill
  Flip chip technology transfer
  High power component assembly onto heat sinks – Thermal interface materials and process issues
  Heat sink attach to PBGA assemblies – Process and automation issues

MARCH MEETING

 
AUTHOR PRESENTATION
  Metallurgy of Mixed No-Pb/SnPb Solder Joints
  Mixed SnPb/no-Pb Soldering: Preliminary Recommendations
  Effects of PCB Surface Finish on the Reliability of Area Array Packages
  Fine-Pitch CSP Rework and Reliability
  Pb-Free Area Array Reliability Update
  Mixed Alloy Reliability (AATC) 2003
  Sn-Ag-Cu Joint Inspection and Failure Analysis
  Thermal Cycling Resistance of 0.4mm Pitch WLCSP Assemblies With Mixed Solder Joints
  Lead Free Wave Soldering Process
  Reliability Effects of Rework Induced Lead/No-Lead Solder Alloy Mixing
  AATC Reliability and Lead Pull Testing
  SnPb Based 0.4 mm Pitch WLCSP Assembly & Reliability
  Area Array Sn/Pb Solder Joint Reliability Year End Wrap-Up
  Mixed Hybrid Assemblie: NanoSphere Wafer Scale Package
  Thermal Cycling Resistance of SnAgCu Based WLCSP Assemblies
  Reflow Encapsulant Manual
  Update on Pb-Free JEDEC Level 3 Moisture/Reflow Sensitivity Testing
  Flip Chip Assembly Manual
  Effects of High Temperature Aging on Thermal Cycling Resistance of LF2 Based Flip Chip Assemblies
  Pb-Free Flip Chip Assembly
  Gold Stud Bumped Flip Chip Assembly
  The Most Promising Underfills
  Flip Chip Underfilling By Stencil Printing
  Underfill Manual
  Sn-Ag-Cu Joint Inspection and Failure Analysis
  Flip Chip Reliability and Test Protocols
  No-Pb Flip Chip Assembly and Reliability with Reflow Encapsulants
  Minimizing Thermal Resistance
  Heat Sink Attach to PBGA Assemblies
  Lid Attach
  Deposition & Curing of Thermal Interface Materials
  Process-Induced Filler Particle Separation in Thermal Interface Materials
  Codification Software