AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2002 MEETINGS

JUNE MEETING

 
AUTHOR PRESENTATION
  Area Array Research Consortium
  Lead-Free Soldering Programupdate On Flip Chip Activities In The Area Array 2002 Consortium
  Flip Chip Reliability – A Brief Review
  Underfill Comparisons In Air-To-Air Cycling And Liquid Shock
  Accelerated Testing Of Flip Chip Underfill – Sensitivity To Aging/Moisture – An Update
  Jet Dispensing Of No-Clean Liquid Fluxes For Flip Chip Assembly
  Lead-Free Pbga Reliability
  Area Array Research Consortium Lead-Free Soldering Program Summary
  Lead Free Bga Aatc Reliability
  Comparison Of Pb-Free Solder On Uic Test Boards And Components

OCTOBER MEETING

 
AUTHOR PRESENTATION
  Flip Chip Program Update
  Flip Chip Results High Temp Jedec Level 3 Testing, Molded Flip Chip & Flip Chip On Flex
  Flip Chip Assembly In Air And Reliability
  Jet Dispensing Of Liquid Fluxes For Flip Chip Assembly
  Pb-Free Flip Chip Assembly
  Pb-Free Flip Chip Reliability
  Packaging Passives And Passing Telcordia
  Area Array 2002 Consortium Presentation Immersion Silver Pcb Finish
  Evaluation Of Underfilling Methods For Csp Assemblies
  Flux Only Assembly Of Wafer Level Chip Scale Packages
  Qfp Assembly & Lead Pull Study (Alternate Surface Finishes)
  Lead Free Testing Update
  Area Array Reliability Update
  Minimization Of Damage To Optical Fibers During Cleaving, Stripping, And Splicing
  On The Loss Of Mass From Optical Adhesives Before, During, And After Cure
  Pin Transfer Of Adhesives
  Codification Software
  Alternate Surface Finishes – Assembly And Reliability Updates
  Reliability Of Double-Sided Assemblies

MARCH MEETING

 
AUTHOR PRESENTATION
  Pb-Free Flip Chip Assembly & Reliability
  Pb-Free Metallurgy Design And Process Issues
  Flip Chip Assembly In Air And Reliability
  Flux Jetting Process Development And No-Clean Liquid Flux Evaluation
  Transfer Molding Of Flip Chips
  First-Level Assembly And Reliability Of An Overmolded Flip Chip Csp
  Flip Chip On Flex
  Reliability Comparison Of 15 Underfills
  Reliability Testing: What Are We Missing?
  High Temperature Jedec Level 3 Moisture/Reflow Sensitivity Testing
  Overview Of 2577 I/O, 52.5 Mm Hyperbga Assembly, Rework, And Reliability Project
  Flux Only Assembly Of Wafer Level Chip Scale Packages
  Optical Fiber Test Interpretation
  Area Array Reliability Overview 2002
  Qfp Assembly & Lead Pull Study (Alternate Surface Finishes)
  Optoelectronics Packaging 2002
  Assembly & Test Of Csps On Flex Pcbs
  Pin Transfer And Dispensing Of Very Small Adhesive Volumes
  Codification Software – 2003
  Updates In Codification Software – 2003
  Alternate Surface Finishes – Solderability, Assembly & Reliability
  Reliability Of Double-Sided Assemblies