- John E. Pomeroy assumes temporary presidency and CEO of both Universal & Dover Technologies Inc.
- Gerhard Meese becomes Universal’s seventh President, drives significant growth at the company
- Universal receives patent for “Advanced Digital Motion Control,” allowing multiple acceleration, deceleration, and velocity rates for Surface Mount placement.
- SMT/TAB Bonder with the first application of platform concept shipped to Apple Computer.
- GSM1™ machine produced and shipped to Motorola, TX who chooses platform for their advanced manufacturing technologies; GSM1 acceptance proven by installation at 33 customer sites.
- GSM2™, dual beam configuration and Dual Head 8 family of Insertion Mount equipment is launched
- APAS Division ships first GSMxs™ high-accuracy placement machine to Hewlett Packard, Fort Collins, CO.
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John Pomeroy assumes presidency of Universal after the resignation of John Peebles.
Gerhard Meese becomes Universal’s seventh President
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First Sanyo Chip Shooter remarketed as Universal equipment. The 4782 HSP provides topside and bottom side applications into solder paste or adhesives.
First Hot Bar Soldering-equipped machine with Boardflo® features for fine pitch assembly installed at NCR, SC.
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1st SMT/TAB Bonder shipped to Apple Computer
OFS1 provides flexibility to insert through hole and mechanical components without tooling changes. The first Odd-Form System (OFS1) was completed; shipped to Turkey.
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Universal receives ISO 9001 registration.
Introduction of the GSM1 platform used for high volume and high-mix manufacturing.
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GSM2 platform was capable of placing different components simultaneously.
GSM platform wins Milton S. Kiver Grand Award for best-in-class product across the spectrum of electronics production equipment and materials.
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Image of Dual Head Jumper Wire Inserter.
Universal introduces the new Flex Jet head for the GSM platform, offering high-speed placement for a wide range of components.
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GSM1xs enables high volume production of flip chip assemblies through a combination of a multiple-spindle head, gang picking and gang dipping.
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A couple additional points in history:
- Universal, IBM and General Electric fund electronic packaging research at T.J. Watson School of Engineering at SUNY Binghamton. Integrated Electronics Engineering Center (IEEC) is christened.
- Placement Machine Characterization Summit held with IPC who later adopts Universal methodology for its industry-wide standard.
- Phil Ragard, 44-year employee (34 patents) and Al Zemek, 30-year employee (33 patents), are honored in ceremonies
- Universal acquires Dynapert Through Hole assembly machine business & Alphasem, a leading Swiss manufacturer of semiconductor equipment
- Company honors retired Chairman J. Donald Ahearn by renaming the Frederick Street building in his name
- Universal acquires Conklin South in the Broome Corporate Park to support future growth in a cost-effective and flexible manner