GenesisSC Platform

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Semiconductor Performance at Surface Mount Speeds

Are high precision die and chip applications increasing your manufacturing costs while lowering your yields, resulting in decreased profits?

Universal Instrument’s GenesisSC offers a complete solution to flip chip package applications by blending the strict accuracy demands of Semiconductor assembly with the speed and robustness of Universal’s Genesis platform. With the ability to handle all facets of flip chip assembly, GenesisSC reduces operating and capital costs by maximizing throughput per floor-space. GenesisSC specializes in extended applications support in the following areas:

• System-in-Package (SiP)


• Flip Chip in Package


• Flip Chip on Board/Flex


• PQFN


Basing this new technology off Universal’s Genesis platforms allows GenesisSC to utilize Variable Reluctance Motor (VRM) technology for speed and repeatable accuracy. In addition, the Genesis platform’s high precision multi-spindle heads provide a unique foundation on which GenesisSC is built.

Universal’s hosts of unique SC elements further compliment this one of a kind solution. The newly introduced Innova provides the ability to present die from 300mm wafers directly to the platform machine. The onboard Linear Thin Film Applicator provides dipping capabilities for paste or flux and the 0.4 mil per pixel camera captures details of the most difficult substrate and fiducial types.