Flip Chip Assembly, Easy as 1,2,3

Category: Flip Chip and Die Placement
Post Date: July 19, 2004
Author(s): Richard Boulanger, Vice President, Advanced Semiconductor Assembly Division, Universal Instruments

Description
Reliable estimates put total flip chip production volume at over one billion units for 2000. Most are being used today in low-priced consumer products, such as calculators and watches, where flip chip on board (FCOB) and flip chip on flexible substrates (FCOF) are the preferred applications. This article examines equipment and process considerations for establishing an integrated high-volume flip chip assembly line which meets both clean room and precision placement requirements, and retains the flexibility needed for the future all at the same time.