Advanced Semiconductor

End users today have come to expect exceptional capability and power from progressively smaller packages, requiring incredible functional density and dissolving the traditional manufacturing boundaries, all the way from the die to the board. Whether your challenges lie in adopting assembly techniques outside the traditional semiconductor packaging domain, or in extending your SMT offering to wafer and substrate levels, partnering with Universal Instruments’ Advanced Semiconductor Assembly division (ASA) ensures the equipment, expertise and support you need to protect and extend your business.

Universal Instruments’ Advanced Semiconductor Assembly division delivers solutions for the convergence generation. Our high-accuracy technologies extend equipment capabilities into the wafer level domain, allowing you to perform challenging flip chip processes on board or flex, place bare die, and assemble complex optoelectronic components.

We know electronic assembly and packaging technology is a moving target. Our equipment development, knowledge building, and customer support programs are constantly evolving to deliver turnkey solutions today, and the most effective response to the challenges to come.

AdVantis XS Platform

A patented VRM linear motor drive provides exceptional performance for this high-accuracy platform ideal for flip chip and other advanced applications.

Wafer Feeder

Incorporates state-of-the-art vision processing and industry-proven approaches to the handling of wafers for optimal throughput, reliability, and flexibility.

Dimensions Line Level Software

Dimensions Line Level Software will maximize the utilization and operational efficiency of your Universal Instruments production lines with NPI and line management software modules architected for maximum flexibility and minimal interdependence.

For more information, contact a Universal Sales Rep.